WMSIC Electronic Components

HGSEMI MC1413M/TR MC1413M

ModelMC1413M/TR
PackageSOP-16
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI MC1413M / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
MC1413M/TR
Electronic Component
1
Package
SOP-16
Type
BJT
Electronic Component
Darlington Transistor Array
Electronic Component
0.33g
Electronic Component
1
Channel Count
Electronic Component
Electronic Component
BM0228150904
Operating Temperature
20℃~+85℃
Current(Ir)
5uA
(Vf)
1.7V
Capacitor(Ci)
15pF
Current(on)
0.93mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MC1413M/TR 产品概述

一、特性概览

MC1413M/TR(品牌:HGSEMI / 华冠,封装:SOP-16)是一款面向通用信号接口与低功耗开关应用的半导体器件。器件设计注重低泄漏、低输入电容与宽工作电压范围,适合在工业控制、传感器接口及电平检测场景中作为前端输入或多通道接口使用。器件工作温度范围为 -20℃ 到 +85℃,适合常见商业与轻工业温度要求。

二、主要电参数

  • 最大允许输入电压 (VI):30 V,保证在此电压以下长期可靠工作。
  • 输入导通电流 (on):0.93 mA(典型),用于估算输入侧驱动阻抗。
  • 输入断态电流 (off):100 µA(典型),断态下仍有微小漏流,设计高阻抗检测时需考虑。
  • 集电极漏电流 (Icex):20 µA,开关/输出端存在微量漏电,应在高灵敏度场合采取拉低/拉高措施。
  • 正向压降 (Vf):1.7 V,输入导通时的典型压降,可用于计算系列限流电阻:R = (Vsup - Vf) / I_on(例如 5V 供电时约 R ≈ 3.5 kΩ)。
  • 反向电流 (Ir):5 µA,反向偏置下的小电流,适当注意反向耐压与保护。
  • 输入电容 (Ci):15 pF,较小的输入电容利于高速边沿响应与信号完整性。

三、典型应用场景

  • 低功耗数字/模拟输入检测:按键、开关、光电传感器等前端接口。
  • 多通道信号采集与接口扩展:SOP-16 封装利于 PCB 布局与多路集成。
  • 工业控制与仪表:在非高温、高压环境下用于状态监测与逻辑触发。
  • 低频开关与电平转换:适合将高阻抗传感器信号转换为可读电平。

四、设计与使用要点

  • 电压裕量:器件最大输入电压 30 V,应保证外部瞬态和工况不会超过该值,必要时加入抑制二极管或瞬态抑制(TVS)。
  • 限流设计:按 Vf=1.7 V、I_on=0.93 mA 估算系列电阻;若供电为 12 V,则 R ≈ (12-1.7)/0.93mA ≈ 11 kΩ。根据所需响应速度与功耗调整。
  • 漏电与偏置:断态漏电(100 µA)与集电极漏电(20 µA)在高阻电路会引入偏置误差,建议配合下拉/上拉电阻以建立确定电位。
  • 布局与滤波:输入电容 15 pF 对高速边沿影响有限,但在敏感测量中仍建议局部去耦和走线短且粗,避免噪声耦合。
  • 温度与可靠性:工作温度 -20℃~+85℃,高温下需关注器件寿命及参数漂移,必要时按经验做额定降额处理。
  • 静电与保护:常规静电防护与适当的浪涌保护能有效提高可靠性。

五、封装与订购信息

  • 品牌:HGSEMI(华冠)
  • 封装:SOP-16,便于表面贴装生产与多通道集成。
  • 型号:MC1413M/TR(未分类具体功能,请在方案设计时参照本参数核验器件用途)。

如需对接具体电路(例如限流、上拉/下拉阻值建议、滤波或 PCB 布局参考),可提供工作电压与负载要求,我将给出更详细的参数计算与设计建议。

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