WMSIC Electronic Components

HGSEMI OPA2277UAM/TR OPA2277UAM

ModelOPA2277UAM/TR
PackageSOIC-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI OPA2277UAM / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
OPA2277UAM/TR
Electronic Component
1
Package
SOIC-8
Electronic Component
Precision Op Amp
Electronic Component
0.232g
Electronic Component
1
Features
Built-in; positions
Electronic Component
BM0227708176
Operating Temperature
20℃~+85℃
Output Current
35mA
(SR)
0.8V/us
Static Current(Iq)
3.5mA
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

OPA2277UAM/TR 产品概述

一、产品简介

OPA2277UAM/TR 是华冠(HGSEMI)推出的双路低噪声、高精度运算放大器,封装为 SOIC-8。器件以超低输入失调、电流和低噪声为主要特色,适用于精密信号调理与测量接口场合。

二、主要参数(典型值)

  • 共模抑制比 (CMRR):140 dB
  • 输入噪声密度 (eN):8 nV/√Hz @ 1 kHz
  • 最大电源差 (VDD–VSS):36 V
  • 推荐双电源范围 (VEE~VCC):2 V ~ 18 V
  • 输入失调电压 (Vos):20 µV
  • 输入失调电压温漂 (Vos TC):250 nV/°C
  • 输入偏置电流 (IB):1 nA;输入失调电流 (IOS):1 nA
  • 增益带宽积 (GBP):1 MHz
  • 压摆率 (SR):1 V/µs
  • 静态电流 (Iq):790 µA
  • 输出电流:35 mA
  • 工作温度:-20 ℃ ~ +85 ℃
  • 放大器数:双路;封装:SOIC-8

三、性能亮点与适用场景

该器件的核心优势在于极低的直流误差(20 µV)与极高的共模抑制(140 dB),配合 8 nV/√Hz 的低噪声,使其非常适合以下应用:

  • 精密仪表放大、差分测量放大器
  • 传感器前端(桥式应变计、热电偶、低频电流/电压采样)
  • ADC 驱动、低噪声缓冲器与低频滤波器
    注意:由于 GBP 为 1 MHz、SR 为 1 V/µs,器件更适合低频精密信号处理,不适用于需高速或大振幅快速边沿的场合。

四、设计与布局建议

  • 电源旁路:在 VCC/VEE 近端放置 0.1 µF 陶瓷与 10 µF 旁路电容,减小电源噪声与振铃。
  • 输入布局:对低偏置电流与低噪声特性敏感,输入引脚应尽量缩短走线,必要时采用屏蔽与接地环隔离高阻节点。
  • 负载与稳定性:避免直接驱动大容性负载;若需驱动容性元件,加上小串联电阻以保障稳定性。
  • 温漂管理:长时间高精度测量时,注意器件自身温度梯度对 Vos 的影响,必要时做温度补偿或恒温控制。

五、选型与注意事项

  • 输出电流峰值约 35 mA,短路与大电流工作会增加发热,应关注封装温升与功耗限制。
  • 对于需要更高带宽或更快压摆率的应用,应考虑带宽/速率更高的型号。
  • 该器件适合单电源或对称双电源使用,确认系统电源差不超过器件最大值(36 V)。
  • 订购信息:OPA2277UAM/TR,品牌 HGSEMI(华冠),封装 SOIC-8。

总结:OPA2277UAM/TR 以其出色的直流精度、超低噪声和高 CMRR,为低频精密测量与传感器接口提供了可靠的解决方案。在布局、电源去耦和负载管理到位的前提下,能在多种精密电子系统中发挥稳定、高精度的性能。

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