WMSIC Electronic Components

HGSEMI LMV722AIDQ2/TR LMV722AIDQ2

ModelLMV722AIDQ2/TR
PackageDFN-8(2x2)
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LMV722AIDQ2 / TR
Type
HGSEMI
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LMV722AIDQ2/TR
Electronic Component
1
Package
DFN-8(2x2)
Electronic Component
Operational Amplifier
Electronic Component
0.066g
Electronic Component
1
Electronic Component
Output
Features
Built-in
Electronic Component
BM0264801302
Operating Temperature
40℃~+125℃
Amplifier
2
Output Current
140mA
(SR)
8.5V/us
Power Supply Voltage
2.1V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LMV722AIDQ2/TR 产品概述

一、产品概况

LMV722AIDQ2/TR 是一款双通道 CMOS 运算放大器,针对低电压单电源应用优化,具有轨到轨输入与轨到轨输出(RRIO)特性,内置补偿,易于闭环稳定。器件适配 2.1V 至 5.5V 单电源系统,或对称双电源 ±1.05V~±2.75V,最大电源差为 5.5V。工作温度范围宽(-40℃ 至 +125℃),适合工业与便携类终端使用。

二、核心性能参数

  • 放大器通道数:2 个
  • 增益带宽积(GBW):10 MHz,适合中等带宽放大与滤波应用
  • 压摆率(SR):8.5 V/µs,能应对较快的瞬态信号
  • 输入失调电压(Vos):典型 500 µV,温漂 2.6 µV/℃,有利于精密直流放大
  • 输入偏置/失调电流(Ib / Ios):约 1 pA,适合高阻抗传感器接口
  • 电压噪声密度(eN):9.5 nV/√Hz @1 kHz,适合对噪声敏感的模拟前端
  • 共模抑制比(CMRR):约 70 dB
  • 静态电流(Iq):约 400 µA(器件典型),在功耗与性能之间取得平衡
  • 输出能力:可提供高达 140 mA 的输出电流(短时驱动能力),适合驱动小负载或做缓冲

三、电源与封装信息

该器件支持宽电源范围(单/双电源),在低电压单电源系统中仍保持 RRIO 表现,便于直接与低电平传感器及 ADC 互连。封装为 DFN-8(2 mm × 2 mm),适合空间受限的移动设备与高密度 PCB 设计。

四、典型应用场景

  • 传感器信号调理:超低偏置电流和小失调适合热电偶、电阻式与高阻传感器接口
  • 便携式仪表与电池供电设备:低电压工作与中等功耗设计
  • 音频前端与低噪声放大:9.5 nV/√Hz 的噪声特性适配轻量音频与微弱信号放大
  • 主动滤波器、采样保持与缓冲驱动:10 MHz GBW 和 8.5 V/µs 压摆率支持常见模拟处理拓扑

五、设计与使用建议

  • 电源去耦:为保证低噪声与稳定性,建议在 Vdd/Vss 近端放置 0.1 µF 与 1 µF 陶瓷并联去耦电容。
  • 负载与散热:虽然峰值输出电流可达 140 mA,但长时间大电流输出会增加器件温升,注意 PCB 散热与负载匹配。
  • 驱动容性负载:若需驱动较大电容性负载,建议在输出串联小电阻以保证稳定。
  • 高阻抗源连接:凭借极低的输入偏置电流,输入端应保持短路径并避免表面杂散导电以发挥优势。
  • 工作电压:保证工作电压在 2.1V~5.5V 范围内并留有裕量,避免跨越最大电源差 5.5V。

六、总结

LMV722AIDQ2/TR 提供双通道、高性价比的低压 RRIO 放大方案,结合 10 MHz 的 GBW、低失调与低噪声特性,适合便携设备、传感器接口与中速模拟处理场合。小型 DFN-8 封装利于空间受限设计,器件在功耗、带宽与输出能力间取得平衡,是需要低电压、高精度前端放大的优秀选择。若需进一步电气参数或评估样片,请参考相应规格书或联系供应商获取完整资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.