WMSIC Electronic Components

HGSEMI LM358M/TR LM358M

ModelLM358M/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM358M / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LM358M/TR
Electronic Component
1
Package
SOP-8
Electronic Component
Operational Amplifier
Electronic Component
0.215g
Electronic Component
1
Electronic Component
BM0227297832
Operating Temperature
0℃~+70℃
Amplifier
2
Output Current
30mA
Power Supply Voltage
3V~36V
Static Current(Iq)
500uA
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM358M/TR 产品概述

LM358M/TR(华冠 HGSEMI)是一款双路低功耗通用运算放大器,适用于单电源或双电源供电场合。器件在宽电源电压范围内工作稳定,具有低输入偏置电流、适中的增益带宽积以及良好的共模抑制性能,适合工业控制、传感器信号调理、滤波与缓冲等多种模拟前端应用。

一、主要技术参数

  • 放大器数:双路
  • 最大电源宽度 (Vdd–Vss):36 V
  • 单电源工作电压:3 V ~ 36 V
  • 双电源工作电压:Vee ~ Vcc = -18 V ~ +18 V
  • 增益带宽积 (GBP):1.2 MHz
  • 输入失调电压 (Vos):典型 7 mV
  • 输入偏置电流 (Ib):典型 250 nA
  • 输入失调电流 (Ios):典型 50 nA
  • 共模抑制比 (CMRR):80 dB
  • 静态电流 (Iq):500 μA(单芯片)
  • 输出电流能力:最大 30 mA
  • 工作温度范围:0 ℃ ~ +70 ℃
  • 封装形式:SOP-8
  • 品牌:HGSEMI(华冠)

二、功能与特色

LM358M/TR属于通用运算放大器家族,设计注重低功耗与宽电源适应性。其主要特色包括:

  • 宽电源电压范围,支持低至3 V的单电源供电,适配便携电源系统;
  • 低静态电流(约500 μA),适合电池供电或功耗敏感的应用;
  • 双通道结构,便于双路信号同步处理或节省系统占板空间;
  • 适中的增益带宽积(1.2 MHz),可满足低频至中频放大与滤波需求;
  • 良好的输入失调与偏置电流指标,利于高精度直流/低频信号放大。

三、应用场景建议

基于上述电气特性,LM358M/TR适合下列应用领域:

  • 传感器信号调理(温度、电压、电流、光电等传感器);
  • 低频放大器、积分/微分电路与有源滤波器(低通、高通、带通);
  • 电压比较、缓冲驱动(非精密比较器替代);
  • 仪表放大器前级、采样前缓冲;
  • 工业控制与自动化电子设备中常用放大器单元。

四、设计与使用注意事项

  • 电源与去耦:建议在芯片电源引脚附近放置0.1 μF和1 μF并联去耦电容,减小电源噪声与瞬态影响,确保稳定工作;
  • 共模输入范围:尽管LM358系列常见于单电源接地参考应用,但输入共模范围和输出摆幅并非完全轨到轨,实际设计时应留出裕量,避免接近电源轨导致失真或失稳;
  • 输出驱动:最大输出电流约30 mA,若驱动低阻负载或继电器线圈需外接驱动器或功率级,以免超出器件能力;
  • 温度与功耗:工作温度限定为0〜70 ℃,应避免高温环境长期使用。散热一般依赖PCB铜箔和外部环境,必要时加大散热面积;
  • PCB布局:模拟信号与电源地线应合理分区,采用星形接地或专用模拟地,减少共地噪声对放大器性能的影响。

五、封装与采购信息

LM358M/TR以SOP-8封装形式提供,适合常规贴片焊接和批量生产。型号后缀/TR通常表示带卷带(Tape & Reel)包装,便于自动贴片生产线使用。华冠(HGSEMI)品牌的该器件在替换同类通用运放时可作为成本敏感型项目的选项,实际采购时请确认证明文件与物料规格书以匹配具体项目需求。

总结:LM358M/TR(华冠)是一款在功耗、供电适应性与通用性能之间取得良好平衡的双路运放,适用于低频信号放大与各种模拟前端应用。通过合理的电源去耦、布线与热管理,可以在工业与民用电子设计中获得稳定可靠的性能表现。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.