WMSIC Electronic Components

HGSEMI LM1117MP-ADJ/TR LM1117MP

ModelLM1117MP-ADJ/TR
PackageSOT-223-3L
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM1117MP-ADJ / TR
Type
HGSEMI
Minimum package
2500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
1.3V@(1A)
Electronic Component
HGSEMI
Electronic Component
0.003%Vout
Electronic Component
LM1117MP-ADJ/TR
Electronic Component
1
Package
SOT-223-3L
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.345g
Electronic Component
1
Electronic Component
BM0229355075
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
15V
Output
Electronic Component
Output Voltage
1.25V~10V
Output Current
1A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM1117MP-ADJ/TR 产品概述

一、概述

LM1117MP-ADJ/TR 是 HGSEMI(华冠)提供的一款单通道可调线性稳压器,封装为 SOT-223-3L,输出为正极性。该器件输出电压可在 1.25V 到 10V 之间调整,最大输出电流 1A,专为需要低纹波、低噪声且简单外围电路的模拟及电源后级应用设计。器件集成过流保护与过热保护,工作结温范围宽 (-40℃ 至 +125℃)。

二、主要性能参数

  • 输出类型:可调(Vref = 1.25V)
  • 输出电压范围:1.25V ~ 10V
  • 最大输出电流:1A
  • 压降(Dropout):约 1.3V @ 1A(设计时需留足头部差)
  • 静态电流(Iq):约 10mA
  • 电源纹波抑制比(PSRR):75dB @ 120Hz(优良的交流纹波抑制)
  • 噪声:0.003% Vout(典型,适合对噪声敏感的电路)
  • 保护特性:过流保护(OCP)、过热保护(OTP)
  • 工作温度范围:-40℃ ~ +125℃(Tj)
  • 封装:SOT-223-3L(带 TR 卷盘包装,便于贴片/插件生产线使用)

三、典型应用与优势

LM1117MP-ADJ/TR 适合为低噪声模拟电路、精密参考、通信终端、机顶盒、路由器以及各种工业控制设备提供稳压电源。其优势在于:高 PSRR 与极低噪声、封装小且易于布局、内建保护功能简化系统设计。

四、典型外部元件与电路建议

  • 输出稳定性:建议在输出端放置 10µF(钽电容或低等效串联电阻的固体电解电容)以保证稳压器稳定工作;输入端同样建议并联 10µF 旁路电容以抑制输入源阻抗带来的振荡。
  • 调整电阻计算:采用经典两电阻分压,Vout = Vref*(1 + R2/R1) + IadjR2,通常取 R1 = 240Ω,可忽略 Iadj 项,R2 = R1(Vout/Vref - 1)。例如要获得 5.0V 输出,R2 ≈ 720Ω。
  • 输入电压要求:工作时 Vin ≥ Vout + Dropout(在最大电流下约 +1.3V 余量)。设计低压输出或高电流场合需特别注意功耗与散热。

五、热管理与布局注意

线性稳压器的功耗 Pd = (Vin − Vout) × Iout,功耗全部以热量形式释放在封装上。SOT-223 在没有大面积散铜的 PCB 上热阻较高,若 Pd 较大(例如差压 7V、Iout 1A 则 Pd = 7W),需增大铜箔散热区或改用外部散热片/升压开关稳压器以避免过热触发保护。布局上尽量将输入/输出电容靠近引脚放置,改善热流与电流回路,地线采用散铜平面以利散热。

六、典型注意事项与选型建议

  • 若目标系统对效率敏感或差压较大时,考虑使用开关降压后再用 LM1117 做后端滤波(低噪声输出)。
  • 对电池供电、低压差应用,建议选择低压差 LDO 产品以减少头部差。
  • 需要批量装配时,可选带 TR(Tape & Reel)包装型号,便于 SMT 线使用。

LM1117MP-ADJ/TR 以其稳定的输出、良好的纹波抑制和简单的外围要求,是许多中低功率、对噪声和稳定性有要求的应用场景的实用选择。若需针对具体应用的电路设计或热设计评估,可提供输入电压、目标输出与最大负载等参数,我可以帮您做更精确的选型与布局建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.