WMSIC Electronic Components

HGSEMI LM324MT/TR LM324MT

ModelLM324MT/TR
PackageTSSOP-14
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM324MT / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LM324MT/TR
Electronic Component
1
Package
TSSOP-14
Electronic Component
Operational Amplifier
Electronic Component
0.21g
Electronic Component
1
Electronic Component
BM0229275327
Operating Temperature
40℃~+85℃
Amplifier
4
Output Current
35mA
Power Supply Voltage
1.5V~30V
Static Current(Iq)
600uA
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM324MT/TR 产品概述(HGSEMI 华冠)

一、产品简介

LM324MT/TR 是华冠(HGSEMI)推出的一款四路通用运算放大器,封装为 TSSOP-14,适用于多通道模拟信号处理场景。器件在宽电源电压范围内工作,能够在单电源或双电源系统中稳定运行,是工业级和消费类电子常用的放大前端芯片。

二、主要电气参数

  • 放大器数:四路
  • 最大电源差(Vdd–Vss):30V
  • 单电源工作电压:1.5V ~ 30V
  • 双电源支持范围:可在 ±16V 以内工作(注意保证两端电压差不超过 30V)
  • 输入失调电压 Vos:7 mV
  • 输入失调电压温漂 Vos TC:9 μV/℃
  • 输入偏置电流 Ib:250 nA
  • 输入失调电流 Ios:5 nA
  • 共模抑制比 CMRR:80 dB
  • 静态电流 Iq:600 μA(器件静态电流,低功耗特性)
  • 输出电流:35 mA(驱动能力良好)
  • 工作温度范围:-40℃ ~ +85℃

三、主要特性与优势

  • 宽电源电压范围,支持低压单电源和常见双电源构架,便于系统设计灵活性。
  • 低静态电流输出,适用于功耗敏感的便携或长生命周期应用。
  • 输入失调与温漂控制良好,便于精密放大与差分测量前端的误差管理。
  • 35 mA 的输出驱动能力,可直接驱动中等负载或后级电路,减少额外驱动器需求。
  • 四路集成在单封装内,有利于节省 PCB 面积和元件成本。

四、应用建议

  • 信号调理与放大:传感器前端、压力/温度/电流信号放大。
  • 多路模拟开关矩阵与多通道采集前端:与 ADC 前端配合使用。
  • 机电控制与工业自动化:反馈放大、误差放大器、滤波器构建。
  • 一般运算放大器用途:比较放大、积分器、低通/带通有源滤波等。

五、使用与布局要点

  • 电源引脚附近建议放置 0.1 μF 陶瓷去耦电容,靠近封装以保证稳定性。
  • 输入端尽量避免大幅度超出电源轨的信号,以防止输入结导通或损伤。
  • 若用于精密测量,建议在放大器输入端采用屏蔽和合理的阻抗匹配以降低偏置误差和噪声影响。
  • 在输出驱动较大负载时注意功耗与散热,确保工作温度在-40℃~+85℃范围内。

六、封装与选型

  • 封装:TSSOP-14,适合空间受限的应用场景。
  • 品牌:HGSEMI(华冠)。在选型时,可结合系统电源范围、偏置电流和温漂要求,评估是否满足最终精度与可靠性指标。

如需进一步的引脚排列、电路示例或典型性能曲线,可提供具体应用场景以便给出更详细的设计建议。

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