WMSIC Electronic Components

HGSEMI LM555CM/TR LM555CM

ModelLM555CM/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM555CM / TR
Type
HGSEMI
Minimum package
2500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LM555CM/TR
Electronic Component
1
Package
SOP-8
Electronic Component
555 Timer
Electronic Component
0.256g
Electronic Component
1
Features
positions
Electronic Component
BM0264548643
Electronic Component
1
Operating Temperature
0℃~+70℃
Operating Voltage
4.5V~15V
Operating Current
1.5mA
Output Current
200mA
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM555CM/TR 产品概述

一、产品简介

LM555CM/TR 是华冠(HGSEMI)推出的一款高精度定时/计时/振荡双极性集成电路,单定时器结构,适合产生精确定时脉冲和可调占空比振荡信号。器件工作电压范围宽(4.5V~15V),在低功耗待机状态下工作电流仅约1.5mA,输出能力强,可直接驱动较大负载,典型输出电流可达200mA。标准 SOP-8 封装,适用于工业和消费类电子的 PCB 安装和自动化生产。

二、主要规格

  • 定时器数量:1 个
  • 工作电压:4.5V ~ 15V
  • 输出电流:最高 200mA(典型)
  • 工作电流(静态):约 1.5mA
  • 工作温度:0℃ ~ +70℃
  • 封装形式:SOP-8
  • 关键功能:占空比可调振荡、复位(Reset)功能

三、功能与特性

  • 高精度定时:内部含两个比较器、RS 触发器及放电晶体管,配合外部 RC 网络能实现稳定的时间常数,适合精确脉冲生成。
  • 占空比可调:典型工作在非稳态(Astable)模式,通过两个电阻和一个电容即可调节频率与占空比,便于 PWM 类控制与时钟源设计。
  • 单次触发(单稳态)支持:在单稳态(Monostable)模式下,触发后产生稳定宽度的单次脉冲,脉冲宽度由外接 R×C 决定。
  • 复位功能:具主动低电平复位引脚,拉低可强制使输出置低,方便系统复位与外部控制。
  • 强驱动能力:推挽输出结构,能直接驱动继电器、小电机或 LED 等负载(注意热耗与散热)。
  • 低功耗待机:静态电流小,适合电池供电或低能耗应用。

四、典型应用与电路

  • 时钟与周期信号源、PWM 调光与速度控制、延时与定时器、脉冲发生器、声光报警驱动、单次脉冲触发电路等。
  • 常用公式(非稳态):频率 f ≈ 1.44 / ((R_A + 2·R_B)·C),占空比 D ≈ (R_A + R_B) / (R_A + 2·R_B)。
  • 单稳态宽度:T ≈ 1.1 · R · C(触发后输出高电平持续时间)。
  • 建议在 Vcc 与地之间放置 0.01µF~0.1µF 陶瓷去耦电容,以抑制电源噪声和提高稳定性。

五、封装与引脚(SOP-8)

SOP-8 标准引脚排列,常见功能包括 VCC、GND、输出、阈值(THRESHOLD)、触发(TRIGGER)、放电(DISCHARGE)、复位(RESET)和控制电压(CONTROL)。设计电路板时请参考 SOP-8 推荐焊盘和热管理规范。

六、使用注意事项

  • 工作电压请保持在 4.5V~15V 范围内,避免超压导致器件损坏。
  • 输出驱动大电流时需关注器件发热,必要时增加散热或降额使用。
  • 复位引脚不使用时应拉高至 VCC,避免触发误动作。
  • 对计时精度要求高的应用,应选用温度补偿或参考器件,并注意外部元件偏差和环境温度影响。
  • 在强干扰或高速开关环境中,推荐在控制脚加入滤波或施加合理防护。

LM555CM/TR 以其成熟的结构、宽电压范围、强输出能力与低静态功耗,为各种定时与振荡应用提供可靠的解决方案。对于需要简单、经济且可重复生产的定时电路设计,LM555CM/TR 是常用且稳健的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.