Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HG24C256CM/TR 是华冠(HGSEMI)推出的一款高可靠性 I2C 接口 EEPROM,单片存储容量为 256Kbit(即 32KB),采用 SOP-8 封装,适用于工业级环境。器件支持 1 MHz 的时钟频率(I2C Fast-mode Plus),工作电压范围宽(1.7V ~ 5.5V),工作温度范围 -40℃ ~ +105℃,在数据保持、写入寿命和抗干扰方面都经过优化,适合需要长期保存配置信息、日志或校准数据的嵌入式系统。
SOP-8 封装常见功能引脚包括 VCC、GND、SDA、SCL、WP(写保护),以及 A0、A1、A2(地址选择或保留引脚,具体配置请参见数据手册)。在系统设计中,应注意正确连接写保护引脚以避免意外写操作,并按 I2C 规范配置上拉电阻。
HG24C256CM/TR 设计面向工业级应用,具有宽温度范围与高数据保持特性。器件典型数据保持 100 年、写周期寿命 200 万次,适合对数据完整性与长期保存有较高要求的系统。为满足系统级可靠性,应在 PCB 设计、热管理和电磁兼容性上做相应验证。
HG24C256CM/TR 是一款面向工业级和长期保存应用的高可靠 I2C EEPROM,宽电压与高耐久性使其在多种嵌入式、工业与通信场景中都具有良好适配性。设计时应关注 I2C 总线布局、写入管理与写保护策略,以发挥器件的最佳性能与长期可靠性。欲获得更详细的时序图、页大小与引脚封装信息,请参考华冠官方数据手册或联系供应商技术支持。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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