WMSIC Electronic Components

HGSEMI LM336M-2.5/TR LM336M

ModelLM336M-2.5/TR
PackageSOIC-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM336M-2.5 / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LM336M-2.5/TR
Electronic Component
1
Package
SOIC-8
Electronic Component
Voltage Reference IC
Electronic Component
±1%
Electronic Component
0.244g
Electronic Component
1
Electronic Component
BM0227687401
Operating Temperature
0℃~+70℃
Output Voltage
2.5V
Output Current
10mA
Output Type
Electronic Component
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM336M-2.5/TR 产品概述

一、产品简介

LM336M-2.5/TR 是华冠(HGSEMI)出品的一款固定输出电压的基准源,输出电压为 2.5V。器件以稳压二极管(串联/分流基准)形式工作,适用于需要稳定低压参考源的模拟与数字电路。标准封装为 SOIC-8,适合自动贴片与卷带包装(/TR 表示 tape & reel,便于量产贴装)。

二、主要参数

  • 输出类型:固定
  • 输出电压:2.5V
  • 输出电流:10 mA(器件在合理范围内工作;设计时应保证不超过该值)
  • 最小阴极电流以维持稳压:400 μA(低于此电流时参考精度可能下降)
  • 工作温度范围:0℃ ~ +70℃
  • 封装:SOIC-8
  • 品牌:HGSEMI(华冠)

三、功能特性与优势

  • 稳定的 2.5V 基准输出,适合做 ADC/DAC、精密比较器或低压电源参考。
  • 工作所需的最低阴极电流仅 400 μA,支持低功耗系统在轻负载下仍能维持参考稳定。
  • 最大输出电流 10 mA,能直接驱动小电流负载或用于给后级电路提供基准电流。
  • SOIC-8 封装便于 PCB 布局与散热处理,/TR 卷带包装适合批量生产使用。
  • 工作温度覆盖商用级应用(0~70℃),适用于多数工业与消费电子场景。

四、典型应用

  • 模数/数模转换的参考电压源(ADC/DAC)。
  • 精密电压比较电路与基准电流源。
  • 低压稳压与监测电路,作为稳压二极管替代以提高精度。
  • 便携式与低功耗仪器的参考基准。
  • 电源管理与测试设备中需要稳定基准的场合。

五、使用建议与注意事项

  • 确保阴极电流(流过基准的电流)始终高于 400 μA,以维持良好稳压特性;同时不要超过 10 mA 以避免过热或器件损坏。
  • 器件为分流/并联参考,通常通过上游串联电阻接到电源,选择电阻时应根据输入电压与所需阴极电流计算,并考虑温度与误差余量。
  • 为改善噪声与瞬态响应,建议在基准输出与地之间并联适当的去耦电容(常见为 0.1 μF ~ 10 μF,视电路稳定性需求而定)。
  • 注意封装功耗与散热:在高输入到输出压差和较高工作电流下,器件会产生较大功耗,应通过合适的 PCB 铜箔与热过孔来降低结温。
  • 工作温度限定为 0~70℃,在超出范围的应用需评估器件性能或选择工业级/扩展温度器件。

六、封装与订购信息

  • 型号示例:LM336M-2.5/TR(TR 表示卷带包装,适合表面贴装生产线自动化使用)。
  • 封装:SOIC-8,便于焊接与自动化装配。
  • 如需批量采购,请与华冠授权分销商确认交期、批次及质量认证(如有环境与可靠性测试需求,请提供相应的技术规范或样品测试)。

总结:LM336M-2.5/TR 以其稳定的 2.5V 固定基准、低最低工作电流和适中的输出能力,适合多种精密基准场合,特别适用于对体积、成本与自动化装配有要求的批量生产设计。

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