WMSIC Electronic Components

HGSEMI LM393M/TR LM393M

ModelLM393M/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM393M / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LM393M/TR
Electronic Component
1
Package
SOP-8
Electronic Component
Comparator
Electronic Component
0.19g
Power Supply
2V~32V
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0227365050
Operating Temperature
0℃~+70℃
Comparator
Electronic Component
Output
TTL;CMOS
Output Type
Electronic Component
Static Current(Iq)
1mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM393M/TR 双路低功耗比较器(HGSEMI 华冠)产品概述

一、产品简介

LM393M/TR 是华冠(HGSEMI)推出的一款双路比较器,封装为 SOP-8,适用于各种电平检测与转换场合。器件采用开漏输出结构,输出与 TTL/CMOS 兼容,便于与微控制器、逻辑电路及外部晶体管直接接口。器件可在单电源或双电源供电下工作,具有低静态功耗与稳定的输入特性,适合电池供电与工业控制应用。

二、主要特性

  • 输出类型:开漏(Open-Drain),需外接上拉电阻实现高电平输出。
  • 输出兼容:TTL / CMOS 兼容电平。
  • 电源范围:单电源 2V ~ 32V,双电源 ±16V(VEE ~ VCC);最大电源差(VDD - VSS)可达 36V。
  • 工作温度:0℃ ~ +70℃(商业级)。
  • 静态电流(Iq):典型 1mA(器件整体静态电流,适合低功耗应用)。
  • 输入失调电压(Vos):约 9mV,适合较高精度阈值检测。
  • 输入偏置电流(Ib):约 400nA;输入失调电流(Ios):约 5nA。
  • 比较器数:双路(两个独立比较单元)。
  • 封装:SOP-8,TR 表示带卷带(Tape & Reel)包装,便于贴片生产线使用。

三、引脚与封装说明

LM393M 标准 SOP-8 引脚排列包括两个比较器的输入、输出、基准与电源引脚。由于输出为开漏结构,输出端必须外接上拉电阻到合适的电源电平(例如 VCC 或逻辑电平),推荐常用值 4.7kΩ ~ 100kΩ,典型 4.7kΩ–10kΩ,可根据速度与功耗要求调整。

四、应用场景与优势

  • 电平检测与门限比较:电池电压检测、过压/欠压报警。
  • 振荡器与方波整形:结合施密特触发或迟滞网络用于噪声抑制。
  • 开关输入接口:将模拟比较结果转换为数字逻辑信号,直接驱动 MCU 中断或输入。
  • 电流/电压监测、零电位检测与窗比较(配合两个比较器实现)。
    优势在于宽电源电压范围、低静态电流及商业级工作温度,适合成本敏感且功耗受限的系统。

五、典型电路建议

  • 上拉电阻:由于开漏输出需要外部上拉,选择上拉电阻时在速度和功耗间权衡;提高上拉阻值可降低功耗但减慢上升沿。
  • 施密特化(加迟滞):在非理想输入或含噪信号场景,建议在正输入与输出间加入反馈电阻形成迟滞,避免抖动。
  • 差分与窗比较:利用两路比较器可实现窗口比较电路,用于电平范围判断。
  • 电源去耦:为保证比较精度与稳定性,应在 VCC 与 VSS 近端并联 0.1µF 陶瓷电容并加 10µF 旁路电容。

六、选型与注意事项

  • 包装后缀 TR 表示卷带包装,适合 SMT 自动贴片;若采购小批量样品可选散装或其他封装。
  • 输入共模范围在接近负电源端时通常表现较好,但在接近正电源端时能力有限,建议在设计时预留裕量。
  • 禁止输入电压超过电源轨过多,否则可能导致内部结构失效;具体过压、ESD 容限建议参考器件详细规格书。
  • 在工业或高温环境下如需更宽温度等级,请选择相应等级器件。

如需原理图参考、典型参数曲线或器件明细(订购编码、包装方式),可提供进一步资料以便针对具体应用给出优化建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.