WMSIC Electronic Components

HGSEMI CD4060DM/TR CD4060DM

ModelCD4060DM/TR
PackageSOP-16
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI CD4060DM / TR
Type
HGSEMI
Minimum package
2500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
CD4060DM/TR
Electronic Component
1
Package
SOP-16
Electronic Component
Counter / Divider
Electronic Component
0.33g
Electronic Component
Electronic Component
Electronic Component
1
Features
positions
Electronic Component
BM0229355076
Reset
Electronic Component
Operating Temperature
0℃~+60℃
Operating Voltage
3V~15V
Logic Type
Electronic Component
Power Dissipation(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CD4060DM/TR(HGSEMI 华冠)产品概述

一、功能概述

CD4060DM/TR 是一款集成了振荡器与多级二进制计数/分频器的 CMOS 逻辑芯片,采用 SOP-16 封装(DM),并以卷带包装(/TR)供货,适合贴片生产线。芯片内部包含一个简单的振荡器接口与 14 级二进制计数器,可把输入振荡信号逐级进行 2 的幂次分频,提供多个不同分频比的输出,用于时钟、延时、频率分频等场合。复位为异步方式(高电平有效),便于在任意时刻清零计数器。

二、主要特点

  • 工作电源范围宽:典型 CMOS 4000 系列供电 3V ~ 15V(具体应参考生产厂商数据手册)。
  • 内置振荡器接口,支持外接 RC 网络构成自由振荡,也可配合晶体或谐振器实现稳定时基(电路取决于使用方式)。
  • 多路分频输出:提供一系列 2 的幂分频输出,可得到从较快到很长的时间常数(可达 2^14 = 16384 倍分频),适合做长时延或低频时钟来源。
  • 异步复位,高电平有效,响应迅速,便于系统复位与强制清零。
  • SOP-16 小外形,适合表面贴装组装和自动化生产。

三、封装与引脚(概要)

  • 封装:SOP-16(DM),卷带包装为 CD4060DM/TR,适合 SMT 贴片制造流程。
  • 典型引脚:包含 VDD(电源)、VSS(地)、复位(异步)、振荡器相关引脚及多个分频输出。为保证可靠工作,建议参考具体脚位图与数据手册进行连线,并对 VDD/VSS 做去耦电容处理。

四、典型应用场景

  • 时基发生器、脉冲/时钟分频源:用作微控制器或逻辑电路的低速时钟或参考时基。
  • 延时与定时电路:通过选择合适的振荡频率和分频输出实现从毫秒到数小时的定时功能。
  • 闪烁、循环驱动:LED 闪烁器、指示灯周期控制等。
  • 低频信号产生与频率合成:在仪表、遥控、报警等系统中替代复杂计数器方案。
  • 故障检测/看门狗辅助电路:与其它逻辑联用实现超时检测。

五、设计与使用建议

  • 振荡器设计:若采用 RC 振荡,常用近似公式 f ≈ 1/(2.2 ~ 2.4 · R · C)(实际频率受芯片输入阈值影响),设计时最好在实验板上调试并测量实际频率。若需高稳定性时基,建议选用晶体或陶瓷谐振器并严格按照推荐接法。
  • 电源与去耦:在 VDD 与 VSS 之间并联 0.01~0.1µF 旁路电容,靠近器件引脚放置,以抑制瞬态干扰。
  • 输入/输出稳健性:避免浮空输入,复位脚应设计明确的上拉或下拉电路;输出为 CMOS 推挽,驱动能力有限,驱动大负载时应加缓冲。
  • 工作频率与温度:最大可用频率受电源电压和温度影响,典型工作频率范围从数十 kHz 到数 MHz 不等,具体请以数据手册或实际测量为准。
  • 复位注意事项:复位为异步(高电平有效),复位信号释放后计数器从零开始计数;若需同步复位功能,应在外部加同步电路。

六、规格摘要与选型建议

  • 品牌:HGSEMI(华冠)生产,型号后缀 /TR 表示卷带包装,便于 SMT 生产线使用。
  • 封装:SOP-16(表面贴装)。
  • 适用场合:需要简单、低成本多级分频或长时间延迟的场合;适合消费电子、工业控制、仪表及教学原型开发。
  • 选型提示:若对速度或功耗有更高要求,可考虑 HC/AC/HCT 等系列或专用定时芯片;若需精确时钟源,建议搭配晶振或使用专用时钟芯片替代 RC 振荡。

总结:CD4060DM/TR 是一颗结构简单、功能实用的振荡 + 多级分频 CMOS 器件,SOP-16 封装便于 SMT 生产,适合在需要低成本时基与大范围分频的电子设计中使用。使用时注意振荡回路设计、电源去耦与复位逻辑,以保证稳定可靠的工作。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.