WMSIC Electronic Components

HGSEMI CD4052BM/TR CD4052BM

ModelCD4052BM/TR
PackageSOP-16
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI CD4052BM / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
CD4052BM/TR
Electronic Component
1
Package
SOP-16
Electronic Component
Analog Switch / Multiplexer
Electronic Component
0.314g
Electronic Component
1
Channel Count
2
Features
Electronic Component
Electronic Component
BM0227365041
Operating Temperature
40℃~+85℃
Operating Voltage
3V~15V
Switch
4:1
(tpd)
7ns
Capacitor(Con)
0.2pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CD4052BM/TR 产品概述

一、产品简介

CD4052BM/TR(华冠 HGSEMI)是一款双通道 CMOS 模拟多路复用/开关器件,内部包含两个独立的 4:1 多路开关,适用于模拟与数字信号的切换与路由。器件采用 SOP-16 封装,工作温度范围 -40℃~+85℃,工作电压宽范围 3V~15V,兼容低压与中高压系统设计需求。

二、主要参数与性能

  • 开关结构:每通道 4:1,多路复用/解复用功能,共 2 通道。
  • 工作电压:3V~15V(推荐设计在规格范围内稳定运行)。
  • 传播延迟 tpd:典型 7ns(受工作电压与负载影响)。
  • 导通电阻 Ron:典型 60Ω(随电源电压、温度与信号电平有一定变化)。
  • 导通电容 Con:约 0.2pF,利于高频性能与低负载影响。
  • 工作温度:-40℃~+85℃。
  • 封装:SOP-16(TR 表示卷带包装,便于贴片生产线使用)。

三、功能特性

  • CMOS 工艺,静态功耗低,适合电池供电系统。
  • 双向导通,适合双向模拟信号传输(在电源轨范围内)。
  • 控制接口简单,逻辑电平与电源电压范围兼容,便于与微控制器直接驱动。
  • 低导通电容和适中的导通电阻在音频、视频及一般测量信号路径中能保证较好保真度。
  • 响应速度快,适合需要快速切换的场合,但在高精度测量应用需关注 Ron 的稳定性与线性度。

四、典型应用场景

  • 多通道信号选择与路由:数据采集系统、传感器阵列输入选择。
  • 音视频信号切换:小型影音设备或前端信号选择。
  • 仪器仪表:多路测量通道的复用与切换。
  • 测试与自动化:测试台、多路信号测量切换模块。
  • 低功耗移动设备与便携设备中的信号管理。

五、使用注意与设计建议

  • 为保证稳定性,建议在 VCC 与 GND 之间靠近芯片放置去耦电容(如 0.1μF)。
  • 模拟输入输出电压应限制在 VSS~VDD 范围内,避免超出电源轨导致内部二极管导通或损坏。
  • Ron 会随电源电压与温度变化,精密测量场合建议在电路中加校准或选用更低 Ron 的专用模拟开关。
  • 若用于高频或高速信号,需评估 tpd、通带损耗与插入损耗。
  • SOP-16 封装的热管理与焊接工艺参照华冠推荐的焊接规范,TR 卷带包装适合贴片生产。

六、选型与替代建议

CD4052BM/TR 适合大部分通用模拟路由场合。如需更低导通电阻或更高频率性能,可考虑性能更优的模拟开关系列;若需兼容性替代,可参考同类双 4:1 CMOS 模拟多路器产品,选型时注意工作电压范围、Ron 与封装一致性。

以上为 CD4052BM/TR 的概要介绍,可用于快速评估在系统中的适用性与注意事项。若需更详细的电气特性曲线、引脚图或参考应用电路,建议索取华冠的规格书(Datasheet)以完成最终设计验证。

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