WMSIC Electronic Components

HGSEMI LM2903MM/TR LM2903MM

ModelLM2903MM/TR
PackageMSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM2903MM / TR
Type
HGSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LM2903MM/TR
Electronic Component
1
Package
MSOP-8
Electronic Component
Comparator
Electronic Component
0.17g
Power Supply
2V~32V
Electronic Component
1
Electronic Component
BM0264548215
Operating Temperature
40℃~+85℃
Comparator
Electronic Component
Output Type
Electronic Component
Static Current(Iq)
600uA
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM2903MM/TR 产品概述

LM2903MM/TR 是华冠(HGSEMI)推出的一款双路低功耗电压比较器,封装为 MSOP-8,适合对尺寸、功耗和工作电压有较高要求的各种工业与便携式应用。器件在宽电源电压下保持稳定工作,并具备低输入失调与低偏置电流,适用于精确门限检测与开漏输出的接口电路设计。

一、主要参数概述

  • 比较器路数:双路(2 通道)
  • 封装:MSOP-8(小型化 8 引脚封装)
  • 输入失调电压 (Vos):典型 1 mV
  • 输入偏置电流 (Ib):典型 100 nA
  • 输入失调电流 (Ios):典型 5 nA
  • 输出类型:开漏(Open-Drain / Open-Collector 型输出,需外接上拉电阻)
  • 静态电流 (Iq):典型 600 μA(整芯片工作电流)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 最大电源宽度 (Vdd - Vss):36 V
  • 单电源工作电压:2 V ~ 32 V
  • 双电源工作电压:±16 V(Vee ~ Vcc)

以上参数体现出该器件在低电压与宽电压范围内均可可靠工作,低失调电压与低偏置电流有助于提高比较精度,开漏输出便于与多种逻辑电平兼容并实现线-或(wired-OR)等功能。

二、封装与引脚功能(简述)

MSOP-8 封装体积小,适合 PCB 空间受限场合。常见引脚功能包括:

  • 电源引脚(Vcc / Vee)用于单/双电源供电;
  • 每一路比较器有一对输入(+、-);
  • 两路比较器输出引脚为开漏输出,需要外接上拉电阻到目标逻辑电平;
  • 其中还有地引脚和备用引脚(具体引脚序号请参考厂家完整引脚图与资料)。

设计时建议参照华冠的封装机械图与引脚定义以保证接线正确。

三、典型应用场景

  • 电池电压监测与欠压检测;
  • 电平比较与阈值检测(例如光电、温度传感器输出检测);
  • 开关信号整形与微控制器中断驱动(利用开漏实现多点共线);
  • 电源管理、过压/欠压保护电路;
  • PWM 比较器、占空比检测与简单模拟比较逻辑;
  • 工业控制与汽车电子中的门限检测(在符合温度与电压规范下)。

四、设计与使用建议

  • 输出为开漏结构:必须在输出端接上拉电阻。上拉电阻阻值的选择需在输出上拉电流、响应速度与功耗之间权衡;常见选择范围为 4.7 kΩ ~ 100 kΩ,具体取值视系统速度与负载能力而定。
  • 电源旁路:在 Vcc / Vss 引脚邻近放置 0.1 μF 陶瓷旁路电容,一来抑制电源噪声,二来提升瞬态稳定性。
  • 输入保护:虽然器件支持较宽的电源电压,但输入端建议避免超过电源轨的过压或负压(如有可能,使用限流或钳位元件保护)。
  • 温漂与精度:器件输入失调为 1 mV 级别,偏置电流为 100 nA 量级。在高精度应用中应考虑输入失调随温度变化与偏置电流对高阻源的影响,可在输入端并联匹配电阻或采用缓冲放大器。
  • 布局与散热:尽管功耗较低,封装小型化带来散热限制。在高环境温度或密集布线下,注意适当的铜箔面积与散热通路,以维持器件在规格温度范围内工作。

五、可靠性与环境适应

  • 工作温度范围为 -40 ℃ 到 +85 ℃,适合多数工业级应用。
  • 最大电源差为 36 V,单电源与双电源工作灵活,便于同一器件用于多种系统电源结构。
  • 开漏输出便于实现多点总线结构,但需要考虑上拉至合适逻辑电平与抗干扰能力。

六、选型与采购建议

LM2903MM/TR(HGSEMI)以其双路配置、小型 MSOP-8 封装、宽电压适应性和低功耗特性,适合批量应用于体积受限或多通道比较场合。选型时请确认:

  • 是否需要开漏输出并准备相应的上拉方案;
  • 系统的电源电压与温度是否在器件工作范围内;
  • 对失调电压与输入偏置电流的精度要求是否与器件参数匹配。

如需最终电气特性曲线、引脚配置图和 PCB 布局建议,请参考华冠(HGSEMI)提供的完整数据手册与封装图纸,以确保设计符合生产与可靠性要求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.