WMSIC Electronic Components

HGSEMI HG24LC32M/TR HG24LC32M

ModelHG24LC32M/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI HG24LC32M / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
HG24LC32M/TR
Electronic Component
1
Package
SOP-8
Electronic Component
EEPROM
Electronic Component
0.2g
Electronic Component
1
Electronic Component
BM0226506943
Electronic Component
32Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.7V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
1MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HG24LC32M/TR 产品概述

一、产品简介

HG24LC32M/TR 是华冠(HGSEMI)推出的一款低压、低功耗 I2C 串行 EEPROM,存储容量为 32Kbit(4K 字节)。器件支持宽电压范围 1.7V 至 5.5V,工作温度覆盖工业级 -40℃ 至 +85℃,适合对数据长期保存与频繁读写有要求的嵌入式系统与工业设备。

二、主要规格

  • 存储容量:32 Kbit(4 KByte)
  • 接口类型:I2C(支持最高时钟频率 fc = 1 MHz)
  • 工作电压:1.7 V ~ 5.5 V
  • 工作温度:-40℃ ~ +85℃
  • 数据保持时间(TDR):100 年
  • 写循环寿命:1,000,000 次
  • 单次写操作时间(Tw):约 5 ms
  • 封装形式:SOP-8
  • 品牌型号:HG24LC32M/TR(华冠)

三、关键特性与优势

  • 宽电压工作范围(1.7V~5.5V),便于与多种微处理器和传感器直接连接,无需额外电平转换。
  • 支持高达 1 MHz 的 I2C 时钟速率,兼容 Fast-mode Plus,提升串行读写吞吐量。
  • 优异的数据保持能力(100 年)和高写入耐久性(100 万次),满足长期保存与频繁写入的需求。
  • SOP-8 小封装,利于批量生产和空间受限的系统集成。
  • 单次写入时间短(约 5 ms),在系统更新配置或日志记录时响应快。

四、典型应用场景

  • 工业控制器与自动化设备:参数配置、校准数据、故障记录保存。
  • 医疗仪器与手持设备:设备标识、配置存储与非易失性日志。
  • 消费电子与家电:设置记忆、用户偏好保存。
  • 通讯与测量模块:固件小段数据缓存、校正系数存储。

五、设计注意事项

  • I2C 总线需配合适的上拉电阻,避免在高速 1 MHz 工作时出现信号完整性问题;上拉阻值应根据系统总线负载和电压选型。
  • 单次写入时间约为 5 ms,连续写入时建议遵循写周期和写保护机制,以避免写冲突或数据损坏。
  • 虽然器件具备高写入寿命,若应用存在极高频率写操作,建议采用写均衡、缓存或外部控制策略以延长系统寿命。
  • 供电与地线布局需注意去耦,尤其在工业环境下加强抗干扰设计,确保数据可靠性。
  • 采用 SOP-8 封装时关注焊接工艺和热循环可靠性,符合 PCB 制造标准。

六、封装与可靠性

HG24LC32M/TR 提供标准 SOP-8 封装,便于现有 PCB 布局替换和自动化贴装。产品面向工业温度范围,并经过耐久性与数据保持测试,适合长期部署的嵌入式系统应用。

总结:HG24LC32M/TR 是一款性能稳健、兼容性强的 32Kbit I2C EEPROM,凭借宽电压、长数据保持以及高写入寿命,适用于多种需要可靠非易失性存储的应用场景。在系统设计时注意总线匹配与写入策略,可充分发挥器件的可靠性与寿命优势。

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