WMSIC Electronic Components

HGSEMI ICL7660MM/TR ICL7660MM

ModelICL7660MM/TR
PackageMSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

15 specifications

Core information

Product name
HGSEMI ICL7660MM / TR
Type
HGSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
ICL7660MM/TR
Electronic Component
1
Package
MSOP-8
Electronic Component
Charge Pump
Electronic Component
0.259g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0264801321
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ICL7660MM/TR 产品概述(HGSEMI 华冠,MSOP-8 封装)

一、产品简介

ICL7660MM/TR 是华冠(HGSEMI)推出的一款基于开关电容(charge-pump)原理的电压转换器,主要用于产生负电源或在系统中形成对称电源轨。芯片体积小,采用 MSOP-8 封装,适合空间受限的便携式与嵌入式应用。器件支持级联使用,可通过多级连接获得更大幅度的电压变换,便于灵活扩展电源方案。

二、主要功能与特性

  • 支持级联:可将多个 ICL7660MM 级联以获得更高幅值的负电压或多级电压源,便于在不同负载和系统拓扑下扩展。
  • 开关电容式转换:无需电感,外部只需若干陶瓷/钽电容即可构成稳健的反相/倍压电路,简单可靠。
  • 小型封装:MSOP-8 低封装高度、节省 PCB 面积,利于高密度电路设计。
  • 低噪声、低成本:适合音频前端、信号调理与低功耗器件供电等对电磁兼容和成本敏感的场景。

三、应用场景

  • 运算放大器提供负电源(±V 电源形成)
  • 便携式设备中产生小电流负轨(传感器、ADC、DAC 前端)
  • 仪表与信号处理电路的对称电源
  • 小功率 RS-232 电平转换、偏置电路及参考电压产生

四、设计与使用注意事项

  • 电容选型:建议使用低 ESR、低 ESL 的陶瓷电容作飞行和旁路电容,以降低纹波与内阻损耗,提高效率与输出能力。
  • 级联实现:级联时要考虑每级的开关损耗与压降,输出电压随负载增加会下降;建议在级联方案中留足裕量并做好热设计。
  • 布局与走线:飞行电容与芯片之间的走线应尽量短且粗,以减少寄生阻抗,并在 VCC 与 GND 间加稳压旁路电容以抑制瞬态噪声。
  • 负载能力:ICL7660MM 更适用于低至中等电流负载(通常为数十 mA 量级),大电流需求应考虑外加缓冲或采用其他拓扑。
  • 温度与可靠性:注意器件的工作温度范围与功耗限制,长期高温下开关损耗会影响输出稳定性与寿命。

五、选型建议与资料获取

在选型时,应根据系统所需的输出电压幅度、负载电流以及噪声和尺寸限制决定是否使用单片 ICL7660MM 或采用级联。MSOP-8 封装适合要求小封装和表贴工艺的场合。为确保设计正确并满足性能指标,推荐参照华冠官方数据手册,获取精确的电气参数、引脚定义、典型应用电路及热特性。

如需样片测试或针对级联/高负载场景的电路建议,我可以进一步给出具体的参考电路与仿真要点。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.