WMSIC Electronic Components

HGSEMI LM358MM/TR LM358MM

ModelLM358MM/TR
PackageMSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM358MM / TR
Type
HGSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LM358MM/TR
Electronic Component
1
Package
MSOP-8
Electronic Component
Operational Amplifier
Electronic Component
0.12g
Electronic Component
1
Electronic Component
BM0227688669
Operating Temperature
0℃~+70℃
Amplifier
2
Output Current
24mA
Power Supply Voltage
3V~36V
Static Current(Iq)
500uA
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM358MM/TR(HGSEMI 华冠)产品概述

一、产品简介

LM358MM/TR 为华冠(HGSEMI)出品的双路运算放大器,封装为 MSOP-8,适用于宽电源电压和低功耗场合。器件在单电源与双电源系统中均能稳定工作,提供较高的共模抑制能力与低输入失调,便于在精度要求中等的模拟信号处理回路中使用。

二、主要性能指标

  • 运算放大器数:双路
  • 共模抑制比(CMRR):80 dB
  • 最大电源宽度(Vdd–Vss):36 V
  • 单电源工作范围:3 V ~ 36 V
  • 双电源工作范围(Vee ~ Vcc):-18 V ~ +18 V
  • 输入失调电压(Vos):5 mV(典型)
  • 输入偏置电流(Ib):250 nA
  • 输入失调电流(Ios):50 nA
  • 增益带宽积(GBP):1.2 MHz
  • 静态电流(Iq):500 µA(典型)
  • 输出电流:24 mA
  • 工作温度范围:0 ℃ ~ +70 ℃
  • 封装:MSOP-8

三、产品特点

  • 低功耗设计,静态电流低,有利于电池供电与便携设备。
  • 宽电源电压范围,兼容多种系统电源配置(单/双电源)。
  • 较高的共模抑制比和较小的输入失调,适合精度要求中等的放大与比较应用。
  • 输出驱动能力适中,可直接驱动小信号负载或作为后级器件的驱动源。

四、典型应用

  • 传感器信号调理(温度、压力、光电等)
  • 低速滤波器、积分与差分放大电路
  • 比较与开关控制电路(需注意速度与输入摆度限制)
  • 电源监测与仿真前端放大
  • 工业控制、家电和仪器仪表等通用模拟电路

五、封装与使用注意事项

  • 封装:MSOP-8,适用于空间受限的表贴应用。使用时注意散热与焊盘设计以保证稳定性。
  • 温度与偏置:工作温度为 0~70 ℃,对环境温度敏感的应用请做好温度漂移校正。
  • 布局建议:模拟信号路径尽量短、旁路电容接近电源引脚以降低电源噪声对放大器性能的影响。
  • 频率响应:GBP 为 1.2 MHz,适合低至中频带宽需求,非高速放大场合请优先考虑。

六、订购信息与替代件建议

  • 型号示例:LM358MM/TR(HGSEMI 华冠,MSOP-8 封装,带卷带包装)
  • 若需更高带宽或更低失调电压,可考虑更高性能的运放替代;如需更低功耗或更严格工作温度范围,可选专用低功耗或工业级器件。

如需完整数据手册、典型电路或封装引脚图,可提供进一步资料以便深入设计验证。

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