WMSIC Electronic Components

HGSEMI MAX485EIM/TR MAX485EIM

ModelMAX485EIM/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI MAX485EIM / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
MAX485EIM/TR
Electronic Component
1
Package
SOP-8
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.238g
Electronic Component
32
Electronic Component
1
Electronic Component
BM0227688672
Operating Voltage
5V
Receiver
1
Data
2.5Mbps
Communication
Electronic Component
Static Current
300uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MAX485EIM/TR 产品概述

一、产品简介

MAX485EIM/TR 是一款面向半双工差分总线通信的收发器,单驱动器/单接收器(1 driver/1 receiver)设计,工作电压为 5V,数据速率可达 2.5Mbps。该器件适用于工业控制、楼宇自控、仪器仪表与串行通信网络中对可靠性和抗干扰能力有较高要求的 RS‑485/RS‑422 类应用。封装为 SOP‑8,便于印制板布线与批量生产。

二、主要技术参数

  • 类型:收发器(半双工)
  • 驱动器数:1,接收器数:1
  • 工作电压:5V
  • 最大数据速率:2.5 Mbps
  • 总线节点数:32(标准单位负载兼容)
  • 静态电流(待机/静态电流):约 300 μA
  • 静电保护:可达 ±16 kV(抗静电能力强)
  • 封装:SOP-8
  • 通讯模式:半双工(需方向控制)

三、功能与特性

  • 低功耗:静态电流约 300 μA,适合长时间带电或低功耗系统。
  • 高速传输:支持高达 2.5 Mbps 的数据速率,满足多数实时控制和测量场合的需求。
  • 强抗扰性:总线端口具备 ±16 kV 级别静电放电防护,提高在现场环境下的可靠性。
  • 标准拓扑兼容:支持典型 RS‑485 多点网络,最多可挂接 32 个节点(标准单元负载计数)。
  • 半双工工作:单一差分对进行收发,需外部方向控制(DE/RE)。

四、典型应用场景

  • 工业现场总线(PLC、传感器网络)
  • 楼宇自控与安防系统(门禁、报警联网)
  • 仪器仪表的串行远程数据采集
  • 电力监控与能源计量点对点或多点通信
  • 需要高抗静电与稳定差分通信的嵌入式系统

五、使用建议与注意事项

  • 终端匹配:在总线两端各并入典型 120Ω 终端电阻以抑制反射。
  • 偏置电阻:建议在总线上设置合适的 bias(上拉/下拉)电阻,确保空闲总线有确定的显性电平,避免噪声触发。
  • 方向控制:半双工模式需要通过 DE/RE 控制驱动器使能和接收器使能,软件或硬件应正确管理发送/接收时序,避免总线冲突。
  • 旁路电容:VCC 旁置 0.1 μF 陶瓷电容,靠近器件引脚布局,以降低瞬态干扰。
  • 布线与接地:差分对宜成对走线,保持特性阻抗一致;总线屏蔽和接地按现场规范处理,防止地环路。
  • ESD 与浪涌防护:虽然器件具备 ±16 kV ESD 抗扰,但在高干扰环境仍建议使用额外的瞬态抑制器或共模电感提高鲁棒性。

六、封装与选型提示

  • 封装为 SOP‑8,适用于常规 SMT 生产工艺;注意焊接工艺参数与散热。
  • 选型时如需更低功耗或更高节点数/速率,可比较同系列或同类器件的规格差异,根据系统供电、布线长度与环境电磁兼容性综合考虑。

总结:MAX485EIM/TR 以其 5V 工作、2.5Mbps 速率、低静态电流与较高的 ESD 抗扰能力,适合工业与楼宇等需长距离差分通信的应用场景。在设计时关注终端匹配、偏置与方向控制,可获得稳定可靠的现场通信性能。

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