Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HGSEMI 74HC08DM/TR 74HC08DM
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HGSEMI 74HC08DM / TR
- Type
- HGSEMI
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HGSEMI
- Electronic Component
- 74HC08DM/TR
- Electronic Component
- 1
- Package
- SOP-14
- Electronic Component
- Logic Gate
- Electronic Component
- 74HC
- Electronic Component
- 3.282g
- Electronic Component
- 1
- Channel Count
- 4
- Electronic Component
- BM0227699428
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 2V~6V
- Logic Type
- and Gate
- Channel Count
- 2
- Static Current(Iq)
- 5.5uA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
74HC08DM/TR 产品概述
一、产品简介
74HC08DM/TR（HGSEMI 华冠）为四路双输入与门（Quad 2‑Input AND Gates），属于 74HC 系列高速 CMOS 逻辑器件。器件在宽电源电压范围内工作，适合低功耗与中速数字逻辑应用，封装为 SOP‑14，工作温度范围 -40℃ 至 +85℃。
二、主要参数
- 逻辑类型：与门（4 通道，每通道 2 个输入）
- 工作电压：2.0 V ~ 6.0 V
- 静态电流 Iq：典型 5.5 μA
- 传播延迟 tpd：约 16 ns @ VCC=5V, CL=15 pF（典型）；另有 18 ns @ 5V, 15 pF 的测试数据，视工况略有差异
- 输入高电平 VIH（示例值）：1.5 V；3.15 V；4.2 V（随 VCC 而变化）
- 输入低电平 VIL（示例值）：0.5 V；1.35 V；1.8 V（随 VCC 而变化）
- 输出电平 VOH（示例范围，取决于 VCC 与输出电流）：3.7 V ~ 4.4 V；4.4 V；5.2 V ~ 5.8 V；5.9 V；1.9 V
- 输出低电平 VOL（示例）：400 mV；100 mV
- 封装：SOP‑14
- 品牌：HGSEMI（华冠）
三、电气特性说明
74HC08 的输入阈值、输出电平和延迟均依赖于供电电压与负载条件。上面列出的 VIH/VIL/VOH/VOL 为不同测试或规格条件下的典型/范围值，实际设计时应参考具体数据表中按 VCC 和 IO 指定的限值。静态电流低，适合电池供电或对静态功耗敏感的场合；传播延迟在几十纳秒量级，适用于中频率数字系统。
四、封装与引脚
SOP‑14 封装利于表面贴装组装，四个与门独立排列，便于在有限 PCB 面积内实现并行逻辑功能。使用时注意管脚排列与 PCB 焊盘设计，建议在电源引脚附近放置去耦电容（0.1 μF）以抑制瞬态干扰。
五、典型应用
- 组合逻辑电路（与非门、加法器、开关矩阵等）
- 地址/数据判定、使能信号合成
- 电平转换场合（需核对 VIH/VIL 与目标逻辑兼容性）
- 低功耗嵌入式与电池供电设备中的逻辑门实现
六、使用建议与注意事项
- 电源旁放置去耦电容，减少传播延迟抖动与电源干扰。
- 与不同电压域芯片互联时，确认 VIH/VIL 是否满足目标逻辑电平；必要时加入电平转换电路。
- 输出驱动能力有限，注意负载电流与扇出（fan‑out）限制，避免在大电流负载下出现 VOH/VOL 超出规格。
- 遵循静电防护与焊接温度规范，避免损伤 CMOS 结构。
概括：74HC08DM/TR 提供低功耗、宽电压范围与四路 2 输入与门功能，适合多种中速数字逻辑场合；设计时应结合具体 VCC/IO 条件查阅数据表以确保信号兼容与可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
