WMSIC Electronic Components

HGSEMI LM393N

ModelLM393N
PackageDIP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM393N
Type
HGSEMI
Minimum package
2000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LM393N
Electronic Component
1
Package
DIP-8
Electronic Component
Comparator
Electronic Component
0.774g
Power Supply
2V~36V
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0227365042
Operating Temperature
0℃~+70℃
Comparator
Electronic Component
Output Type
Electronic Component
Static Current(Iq)
2.5mA
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM393N 产品概述

一、概述

LM393N(HGSEMI 华冠品牌,DIP-8 封装)是一款双路差分比较器,输出为开漏(Open-Collector)结构,适用于电平检测、限幅、过欠压保护、脉冲整形与模拟信号比较等多种场合。器件支持单电源和双电源工作:单电源电压范围为 2V 至 32V,双电源为 ±16V,且最大电源差(Vdd–Vss)为 36V。工作温度范围为 0℃~+70℃,静态电流(Iq)典型为 600 μA(整片),为低功耗设计提供了良好基础。

二、主要特性

  • 双路独立差分比较器,封装:DIP-8
  • 输出类型:开漏(需要外部上拉电阻)
  • 电源范围:单电源 2V~32V;双电源 ±16V;最大电压差 36V
  • 工作温度:0℃~+70℃
  • 低静态电流:Iq ≈ 600 μA(整片)
  • 输入失调电压 Vos:2 mV(典型)
  • 输入偏置电流 Ib:100 nA;输入失调电流 Ios:5 nA

三、电气参数要点

  • 输入失调电压 Vos(2 mV)影响比较阈值精度。在精密比较场合需考虑 Vos 带来的偏差或采用外部校准。
  • 输入偏置电流(Ib ≈ 100 nA)对于高阻抗信号源会引入误差,建议对高阻抗输入使用缓冲或降低源阻抗。
  • 开漏输出不能主动上拉至高电平,必须外接上拉电阻至所需逻辑电压(不可超过器件的电源限制)。
  • 静态功耗较低,适合电池供电或待机场合,但在高频切换或驱动较大上拉电流时应考虑功耗增加。

四、引脚与封装

  • 封装形式:DIP-8,适合面包板原型、通孔焊接与低成本批量安装。
  • 开漏输出适配多种逻辑电平:上拉电阻可以接至任意合适电压,直至器件最大允许值(参考器件电源限制),便于与 TTL、CMOS 等电平兼容。

五、典型应用

  • 电平比较、阈值检测(电源电压监测、温度报警等)
  • 方波整形与欠压/过压保护电路
  • 脉冲宽度/占空比检测、振荡器和脉冲整形
  • A/D 比较、传感器信号判别(配合适当的前端滤波或缓冲)

六、设计与使用建议

  • 上拉电阻选择:上拉电阻值在 1 kΩ~100 kΩ 范围内常用。若需要较快的上升时间和低输出饱和电压,选择较小阻值(如 1 kΩ~10 kΩ);若注重低功耗,可选较大阻值(如 47 kΩ~100 kΩ)。具体取值根据上拉电压、允许的输出下拉电流与速度需求确定。
  • 电源旁路:在 VCC 与地之间放置 0.1 μF 陶瓷旁路电容,近引脚布置,抑制电源瞬变和开关噪声。
  • 输入保护:若输入可能超出电源范围或存在尖峰,建议串联小阻(几百欧姆到几千欧姆)并使用限幅二极管,以避免输入级损伤或增加失真。
  • 高阻抗源驱动:对于高阻抗传感器输出,优先使用运放缓冲或降低源阻抗,以减少输入偏置电流引起的误差。
  • 温度与漂移:器件标称工作温度 0℃~+70℃,在极端温度或高精度应用中需关注温漂与失调随温度变化的影响。

七、封装与采购建议

  • HGSEMI(华冠)品牌的 LM393N 提供 DIP-8 封装,便于手工焊接与快速原型测试。量产建议根据 PCB 制程选择相应的贴片封装以降低成本。
  • 采购时注意核对完整型号、批次及数据手册,确保电气参数与应用需求匹配,并关注供应商提供的质量与可靠性证明。

总结:LM393N(HGSEMI,DIP-8)是一款通用、低功耗且灵活的双路差动比较器,适合多种电平检测与接口场合。合理选择上拉电阻、做良好电源旁路与必要的输入保护,可在实际系统中获得稳定可靠的比较性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.