WMSIC Electronic Components

HGSEMI LM4890MM/TR LM4890MM

ModelLM4890MM/TR
PackageMSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM4890MM / TR
Type
HGSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LM4890MM/TR
Electronic Component
1
Package
MSOP-8
Electronic Component
Audio Power Amplifier
Electronic Component
0.179g
Electronic Component
1
Features
ESD; Analog Voltage; /; / Switch
Electronic Component
BM0264548645
Operating Voltage
2.5V~5.5V
Output Power
1.2W×1@8Ω;0.35W×1@8Ω
Static Current(Iq)
1.06mA
Speaker Channel Count
Electronic Component
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM4890MM/TR 产品概述

一、产品简介

LM4890MM/TR 是一款面向便携式音频应用的线性稳压器(LDO)型 1W 单声道音频功率放大器,封装为 MSOP-8,由 HGSEMI(华冠) 提供。器件工作电压范围宽 (2.5V~5.5V),集成多项实用功能,适合电池供电或低电压系统驱动小型扬声器,能够在有限功耗条件下实现良好的音频再现效果。

二、主要性能参数

  • 扬声器通道数:单声道
  • 输出功率:1.2W × 1 @ 8Ω;0.35W × 1 @ 8Ω(器件在不同工作条件下的典型输出能力)
  • 总谐波失真+噪声 (THD+N):0.123%(典型值,表征音质保真度)
  • 静态电流 (Iq):1.06mA(静态待机功耗低,利于电池供电)
  • 电源纹波抑制比 (PSRR):-63dB(对电源纹波抑制能力强,有利于降低电源噪声影响)
  • 工作电压:2.5V ~ 5.5V
  • 封装:MSOP-8

三、功能特性

  • ESD 保护:输入/输出端具备静电放电防护,提高系统可靠性与生产良率。
  • 模拟电压增益:内部设定的增益结构,适配常见前端信号电平,便于与音量控制或音源直接对接。
  • 使能/关断功能:支持使能管脚控制,可实现快速上电/关断,降低系统待机功耗。
  • 自动静音/免噪音开关:电路设计上具备消除开关噪声的处理,能够在使能切换时避免明显的“啪嗒”声或突变噪音。

四、典型应用场景

  • 便携蓝牙音箱、随身扬声器
  • 玩具音响、电子提示器、智能家居语音提示模块
  • 电池供电的手持设备音频放大
  • 需要低功耗待机与较好音质的嵌入式音频输出场合

五、设计与使用建议

  • 电源与去耦:尽量在电源引脚附近布置足够的旁路电容(例如陶瓷电容),以确保稳定供电并发挥 PSRR 优势。
  • 布线与接地:建议采用连续的接地平面,输入/输出走线尽量短,避免长串联走线将高频噪声耦合回放大器。
  • 热管理:MSOP-8 封装体积较小,长时间大功率输出时需考虑 PCB 铜箔散热与合理布局,避免器件过热影响性能或寿命。
  • 开关过程控制:利用使能/静音功能可以实现无噪音开关,建议在系统初始化中设置合理的启动延时与升压斜率以降低点击声。

六、封装与可靠性

  • 封装形式:MSOP-8,适合高密度板载应用,便于自动贴装和批量生产。
  • 可靠性关注点:建议在产品验证阶段进行长时间老化与 ESD 抗扰测试,结合实际使用温度与负载条件确认热限及长期性能稳定性。

七、总结

LM4890MM/TR 将低静态功耗、较高的输出功率与良好的电源抑制能力结合在紧凑的 MSOP-8 封装中,适合对功耗、体积和音质都有要求的便携音频应用。其内置的 ESD 保护、使能/静音控制及较低的 THD+N,使得在实际产品设计中能够减少外围元件、简化系统设计并提升用户体验。设计时注意电源去耦、散热与 PCB 布局,可更好地发挥器件性能。

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