WMSIC Electronic Components

HGSEMI SN75176BM/TR SN75176BM

ModelSN75176BM/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI SN75176BM / TR
Type
HGSEMI
Minimum package
2500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
SN75176BM/TR
Electronic Component
1
Package
SOP-8
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.21g
Electronic Component
32
Electronic Component
1
Features
Tx / Rx;;; Low Power
Electronic Component
BM0264548638
Operating Temperature
0℃~+70℃
Operating Voltage
4.5V~5.5V
Receiver
1
Data
10Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN75176BM/TR 产品概述

一、产品简介

SN75176BM/TR 是 HGSEMI(华冠)推出的一款用于 RS-485/RS-422 总线通信的半双工高速收发器,工作电压范围为 4.5V~5.5V,支持最高 10Mbps 的数据速率。器件集成了驱动器与接收器各 1 路,适用于多点差分总线拓扑,单个总线上可连接多达 32 个节点,适合工业控制、楼宇自动化、仪器仪表等需要长线差分通信的场景。

二、主要规格与性能

  • 类型:半双工收发器(1 驱动器 / 1 接收器)
  • 工作电压:4.5V ~ 5.5V(典型 5V 系统兼容)
  • 数据速率:最高 10Mbps(差分传输)
  • 支持节点数:最多 32 节点(总线多点)
  • 静态/待机电流:典型 500 μA(低功耗设计)
  • 工作温度:0℃ ~ +70℃(工业级环境下常用范围)
  • 封装:SOP-8(表面贴装)

三、功能特性与保护机制

  • Tx/Rx 使能:独立的发送/接收使能管脚,便于软件/硬件控制半双工通讯的方向切换与节能管理。
  • 使能关断与低功耗模式:在不通信时可进入低功耗状态,典型静态电流 500 μA,适合电源敏感型设计。
  • 热关断保护:内置过温保护,防止因短路或高功耗工作导致器件损坏。
  • 失效保护电路(Fail-safe):在空闲、差分线开路或短路时,接收端可保持定义的稳定电平,避免总线上出现不确定信号。
  • 静电与抗扰度:器件设计兼顾生产测试与现场抗静电能力;标准静电保护等级为 ±2kV(生产测试基准),同时器件设计在人体模型(HBM)场景下可提供高达 ±8kV 的抗 ESD 能力,增强现场可靠性。

四、封装与引脚注意

SOP-8 封装,体积小、便于 PCB 布局。使用时建议靠近 VCC 放置去耦电容,并将差分对 A/B 尽量成对且短距离布线,避免与噪声源平行走线,以保证高速差分信号完整性。

五、典型应用与设计要点

  • 应用场景:工业自动化现场总线、楼宇控制系统、数据采集模块、串行网关、变送器等。
  • 布线与终端:长线传输建议在远端使用匹配终端电阻(常见 100~120Ω)以抑制反射;必要时在总线上增加偏置电阻网络保持总线空闲状态。
  • 电源与去耦:5V 电源侧应靠近器件放置 0.1 μF 陶瓷去耦,必要时并联大容量电解或钽电容以稳定低频纹波。
  • 保护措施:在强干扰环境下可在差分线上并联共模电感或浪涌抑制器件提升抗干扰能力;关注接地回路与屏蔽的实现以减少共模干扰。

六、选型与注意事项

在选型时确认工作温度范围与系统供电稳定性。若应用环境存在更高温度或严苛工业级要求,可与厂商确认更宽温度等级或增强型防护型号。对于需要更高节点数或更长距离/更高抗扰度的系统,需评估线缆特性、终端方案以及差分对的 PCB 布局优化。

总结:SN75176BM/TR(HGSEMI 华冠)的半双工 10Mbps 收发器在保持低功耗与多点能力的同时,集成了使能控制、热关断与失效保护等实用功能,适合工业与商业级 RS-485/RS-422 差分通信应用。

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