WMSIC Electronic Components

HGSEMI CD4073BM/TR CD4073BM

ModelCD4073BM/TR
PackageSOP-14
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI CD4073BM / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
CD4073BM/TR
Electronic Component
1
Package
SOP-14
Electronic Component
Logic Gate
Electronic Component
4000
Electronic Component
0.29g
Electronic Component
1
Channel Count
3
Electronic Component
BM0265276002
Operating Temperature
40℃~+85℃
Operating Voltage
5V~15V
Logic Type
and Gate
Current(IOH)
1mA
Current(IOL)
6.8mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CD4073BM/TR 三输入与门产品概述

一、产品定位与系列归属

CD4073BM/TR是HGSEMI(华冠半导体) 推出的4000系列CMOS逻辑器件,属于三输入与门(含3个独立与逻辑单元),采用SOP-14小型封装,适配通用数字逻辑控制、工业级环境及低功耗系统需求。4000系列作为经典CMOS逻辑家族,以低功耗、宽电压范围、抗干扰性强为核心优势,CD4073BM/TR继承了该系列的成熟特性,同时针对工业场景优化了温度范围与可靠性,可直接替换同类4000系列器件。

二、核心性能参数详解

CD4073BM/TR的关键参数充分体现了CMOS器件的低功耗与宽适应性,具体如下:

1. 逻辑与电压覆盖

逻辑类型为三输入与门(单通道支持3路输入逻辑判断,共3个独立通道),工作电压覆盖5V~15V宽区间,可兼容5V TTL电平、10V/15V CMOS电平,无需额外电平转换电路,简化系统设计。

2. 低静态功耗

静态电流(Iq)仅250nA,远低于TTL器件的功耗水平,适合电池供电的便携设备(如手持测试仪表)或长期待机的低功耗系统,显著降低待机能耗,延长设备续航时间。

3. 输入输出特性

  • 输入自适应:输入高电平(VIH)随工作电压动态适配(Vcc=5V时3.5V、10V时7V、15V时11V),输入低电平(VIL)同理(Vcc=5V时1.5V、10V时3V、15V时4V),保证不同电压下输入信号的可靠识别;
  • 输出驱动:输出高电平(VOH)接近电源电压(Vcc=5V时4.95V、10V时9.95V、15V时14.95V),输出低电平(VOL)仅50mV,拉电流(IOH)达1mA,可驱动多数数字负载(如LED、小型逻辑门)。

4. 速度与环境适应性

  • 传播延迟:60ns@10V、50pF负载,响应速度满足中等速率的逻辑控制需求(如信号选通、条件触发);
  • 温度范围:-40℃~+85℃,符合工业级温度标准,可适应户外、车间等恶劣环境(如低温存储、高温车间)。

三、封装与引脚设计

CD4073BM/TR采用SOP-14(小型 outline 封装),引脚数量为14,布局遵循4000系列14脚封装规范:

  • 电源引脚:通常14脚为Vcc(正电源)、7脚为GND(地);
  • 逻辑引脚:前3脚为第一组与门输入(1/2/3)、4脚为输出;中间3脚为第二组输入(5/6/7)、8脚为输出;最后3脚为第三组输入(9/10/11)、12脚为输出;13脚可留空或接地(依设计需求)。

SOP封装体积小(约7.2mm×5.3mm)、焊接便捷,适合高密度PCB布局,同时兼容自动贴装工艺,降低生产难度。

四、典型应用场景

基于其宽电压、低功耗、工业级温度的特性,CD4073BM/TR可广泛应用于以下场景:

1. 工业控制领域

PLC(可编程逻辑控制器)的逻辑判断单元、传感器信号选通、电机控制接口等,适应-40℃~+85℃的工业环境,抗干扰性强(CMOS工艺),可减少电磁干扰对系统的影响。

2. 低功耗便携设备

手持数据采集器、电池供电的测试仪器、智能传感器节点等,利用250nA静态电流延长待机时间,无需频繁更换电池。

3. 通用逻辑电路

数字系统中的条件触发(如多条件同时满足时输出高电平)、信号逻辑组合(与或非门配合实现复杂逻辑)、按键防抖(与电容配合过滤抖动信号)等。

4. 电平兼容接口

连接5V TTL电路与15V CMOS电路,无需额外电平转换芯片,简化电路设计(如单片机与高压传感器的接口)。

五、品牌与可靠性保障

HGSEMI(华冠半导体)作为国内专注于功率器件与逻辑器件的制造商,其4000系列产品经过多年市场验证,符合GB/T 16514等国内标准及国际IEC相关规范。CD4073BM/TR的SOP-14封装采用耐高温塑料封装,引脚采用镀锡工艺,抗腐蚀能力强;器件内部采用CMOS工艺,抗静电能力达2kV(人体模型),可靠性满足工业级应用要求。

总结

CD4073BM/TR凭借宽电压范围、低静态功耗、工业级温度与成熟的4000系列特性,成为通用数字逻辑控制、工业场景及低功耗系统的高性价比选择,可替代同类进口器件,降低采购成本。

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