WMSIC Electronic Components

HGSEMI AT24LC16M/TR AT24LC16M

ModelAT24LC16M/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI AT24LC16M / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
AT24LC16M/TR
Electronic Component
1
Package
SOP-8
Electronic Component
EEPROM
Electronic Component
0.2g
Electronic Component
1
Electronic Component
BM0264801312
Electronic Component
16Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.7V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
1MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AT24LC16M/TR 产品概述

一、概述

AT24LC16M/TR 为 HGSEMI(华冠)系列 16Kbit 串行 EEPROM,采用标准两线 I2C 接口,针对低功耗与宽电压范围应用进行了优化。器件内含 16384 位可擦写非易失性存储器,按 8 位字组织,共 2048 × 8 位(2048 字节),可用于保存设备配置、校准数据、序列号和小容量日志等信息。AT24LC16M/TR 支持多种小型封装并提供卷带(/TR)贴片交付方式,便于工业化量产贴装。

二、主要参数与功能特性

  • 存储容量:16 Kbit(2048 × 8 位,2048 字节)
  • 接口类型:标准两线 I2C 总线
  • 时钟频率 (fc):最高可达 1 MHz(Fast-mode Plus)
  • 写周期时间 (Tw):典型 5 ms(每次页写完成时间)
  • 数据保留 (TDR):典型 100 年
  • 写周期寿命:典型 1,000,000 次
  • 工作电压:1.7 V ~ 5.5 V,支持单电源宽电压设计
  • 工作温度:-40 ℃ ~ +85 ℃(工业级)
  • 功能特性:
    • 硬件写保护(WP 引脚)以实现对整个器件写保护
    • 噪声抑制电路,增强对总线干扰和瞬时噪声的鲁棒性
    • 两线总线多器件挂接支持,地址/寻址兼容通用 I2C 体系

三、电气与环境指标(概要)

  • 供电电压范围覆盖低压系统(1.7 V)至典型 5 V 器件,适配多种 MCU/SoC 电源域
  • 在最高工作频率下仍保持可靠的读写操作,便于高吞吐量配置/数据访问
  • 广泛温度范围与长数据保持时间,适合工业级长期可靠性要求
  • 写入/存储周期与保留性能适合频繁配置更新以及长期数据归档

四、封装与机械信息

  • 常见封装类型:
    • 8 引脚 SOP(SOP-8)
    • 8 引脚 DIP(DIP-8)
    • 8 引脚 MSOP(更小体积)
    • 5 引脚 SOT-23(超小型封装,节省 PCB 空间)
  • 标识与交付:
    • 型号后缀 /TR 通常表示卷带(Tape & Reel)交付,适合 SMT 自动化贴装
  • 引脚功能集中,含标准 VCC、GND、SDA、SCL、WP 等,便于在有限 PCB 空间内集成

五、典型应用场景

  • 工业控制器与嵌入式系统:保存设备配置、PID 参数和校准数据
  • 消费电子与可穿戴设备:固件外设参数、用户偏好存储
  • 通信与网络设备:MAC、序列号、生产信息及配置备份
  • 智能计量与测量仪器:长期记录校准及校验参数
  • 物联网终端:低功耗配置与状态保存,适配电池供电产品

六、集成建议与设计注意事项

  • 电源与上拉:在多器件 I2C 总线上,SDA/SCL 需通过合适阻值的上拉电阻连接至 VCC,推荐根据速率与总线负载选择阻值(常见 2.2kΩ~10kΩ)。
  • 写保护管理:当需防止意外写操作时,使用 WP 引脚将器件置于写保护状态;在必须写入时由主机主动解除保护。
  • 写周期管理:由于单次写操作需要典型 5 ms,请在固件中实现写完成检测或等待机制,避免在写周期中断电或发起重复写操作。
  • 抗扰动设计:利用器件内置噪声抑制功能并在 PCB 布线时注意总线走线、去耦与地线回流,提升可靠性。
  • 兼容性与寻址:在多器件系统中确认地址分配与/或器件寻址方式,避免地址冲突。使用 /TR 卷带部件时,确认封装引脚顺序与焊盘匹配。

七、选型与订购提示

  • 型号:AT24LC16M/TR(HGSEMI/华冠品牌)
  • 封装建议:批量 SMT 生产优先选择 SOP-8 或 MSOP-8;空间受限或便携设备可考虑 SOT-23-5。
  • 交付形式:/TR 表示卷带包装,便于 SMT 贴片生产线直接使用
  • 选型依据:根据电压兼容性、写入寿命与数据保留需求选择本器件以满足工业级长期可靠性要求

如需针对具体应用的接线示例、固件写入流程或 PCB 布局建议,我可以提供更详细的参考资料与设计要点。

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