WMSIC Electronic Components

HGSEMI CD4017CMT/TR CD4017CMT

ModelCD4017CMT/TR
PackageTSSOP-16
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI CD4017CMT / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
CD4017CMT/TR
Electronic Component
1
Package
TSSOP-16
Electronic Component
Counter / Divider
Electronic Component
0.232g
Electronic Component
5
Electronic Component
Electronic Component
Electronic Component
1
Features
positions; Static
Electronic Component
BM0264880000
Reset
Electronic Component
Operating Temperature
40℃~+85℃
Operating Voltage
3V~15V
Electronic Component
5.5MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CD4017CMT/TR 产品概述

一、产品简介

CD4017CMT/TR(HGSEMI 华冠)为兼容 CD4017BMT/TR 的升级替代型号,是一款 5 阶 Johnson 译码计数器,内部由五个触发器级构成十路译码输出。器件采用 TSSOP-16 封装,适用于灯光流水、分频计数、事件计数与顺序控制等场合,建议先行试样验证系统兼容性与性能。

二、主要电气与环境参数

  • 工作电压:3V ~ 15V,适配宽电源范围的系统设计;
  • 计数速率(最大时钟频率):5.5 MHz(典型),适合中高速时钟应用;
  • 触发沿:上升沿触发,便于与多数时序发生器配合;
  • 复位方式:异步复位,复位信号可立即置位而不依赖时钟沿;
  • 传播延迟 tpd:85 ns,便于估算级间时序与系统延迟;
  • 工作温度:-40℃ ~ +85℃,满足工业级温度要求;
  • 最大耗散功率 Pd:500 mW,布板时需注意热耗散与环境温度限制;
  • 功能特性:支持复位功能与静态运行(低静态工作电流,适合长期待机场合)。

三、功能与行为说明

该器件为 5 阶 Johnson 环计数器,输出为十路独立译码信号,按上升沿逐一循环置位。异步复位使外部控制器能即时将计数清零,适用于需快速回归初态的控制场景。静态运行特性意味着在无切换时静态功耗较低,有利于低功耗设计。

四、应用场景

适用于:

  • LED 灯阵流水、装饰灯效果与显示驱动;
  • 频率分频、时序发生器、脉冲计数器;
  • 游戏机、玩具、消费电子的顺序控制与状态指示;
  • 工业控制中需要多路轮询或序列选择的场合。

五、设计与使用建议

  • 在电源引脚靠近器件处放置 0.1 μF 去耦电容,降低瞬态干扰;
  • 注意 Pd 与工作温度限制,高电压或高环境温度下需评估功耗与散热;
  • 若系统时钟接近 5.5 MHz,应留有余量并核实上升沿驱动能力与抖动容限;
  • 异步复位信号应避免毛刺,必要时加滤波或同步处理以防误复位;
  • 推荐样片评估,验证与现有 CD4017BMT/TR 引脚兼容性与电气特性。

六、替代与采购建议

作为 CD4017BMT/TR 的升级替代,CD4017CMT/TR(HGSEMI)在封装与功能上具有良好兼容性。建议先行小批量试样验证在目标电源电压、温度及时序条件下的表现,再进行批量采购。如需更详细的引脚图、典型接线与时序图,请联系供应商获取完整数据手册与应用注记。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.