WMSIC Electronic Components

HGSEMI MC34119M/TR MC34119M

ModelMC34119M/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI MC34119M / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
MC34119M/TR
Electronic Component
1
Package
SOP-8
Electronic Component
Audio Power Amplifier
Electronic Component
0.24g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0264801292
Operating Temperature
20℃~+70℃
Operating Voltage
2V~16V
Output Power
55mWx2@16Ω
Speaker Channel Count
Electronic Component
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MC34119M/TR 产品概述

一、概述

MC34119M/TR(品牌:HGSEMI/华冠)是一款面向低功率音频场合的立体声功率放大器芯片。器件采用SOP-8封装,支持最低2V工作电压,能以差动输出(BTL)方式直接驱动扬声器,无需输出耦合电容,特别适合电话听筒、便携式音频与低功耗音源放大场合。

二、主要性能参数

  • 通道数:双声道(立体声)
  • 输出功率:55mW × 2(在16Ω负载下)
  • 总谐波失真 + 噪声(THD+N):0.5%
  • 电源纹波抑制比(PSRR):52dB
  • 工作电压:2V~16V
  • 工作温度范围:-20℃~+70℃
  • 功能:使能/关断(Enable/Shutdown)控制
  • 封装形式:SOP-8

三、功能与特点

  • 支持低电压启动,适配干电池与小型电源系统;
  • 差动输出(BTL)结构,提高输出电压摆幅与功率,省去耦合电容;
  • 内置使能/关断引脚,便于系统节能与静音控制;
  • 良好的PSRR(52dB)与较低THD+N,适用于对音质有基本要求的便携设备。

四、典型应用

  • 电话或对讲机的扬声器驱动;
  • 便携式音箱、掌上设备和儿童电子玩具;
  • 家用小型音频终端、线路驱动与提醒器等低功耗场景。

五、使用建议与注意事项

  • 输出以差动方式驱动扬声器,连接时注意扬声器阻抗与额定功率,推荐16Ω以达到标称功率;
  • 电源引脚应靠近芯片做去耦电容(如0.1µF与10µF并联)以保证稳定与抑制纹波;
  • 在高电压或高功耗工作点注意散热与PCB铜箔面积,避免持续过热;
  • 利用使能引脚实现功耗管理,短路或输出短接会导致过热或损坏,应加以保护;
  • 环境温度在-20℃~+70℃外使用需评估可靠性与寿命。

六、封装与可靠性

MC34119M/TR采用工业常用的SOP-8封装,便于批量贴片生产与焊接。华冠出品,适合对成本与稳定性有均衡要求的消费电子产品。建议在最终设计中结合实际负载与工作电压做仿真测试与样机验证,以确保声音表现与可靠性满足产品目标。

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