WMSIC Electronic Components

HGSEMI 74HC14DM/TR 74HC14DM

Model74HC14DM/TR
PackageSOP-14
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI 74HC14DM / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
74HC14DM/TR
Electronic Component
1
Package
SOP-14
Electronic Component
Inverter
Electronic Component
74HC
Electronic Component
0.31g
Electronic Component
1
Channel Count
6
Features
Electronic Component
Electronic Component
BM0227638612
Operating Temperature
0℃~+60℃
Operating Voltage
2V~6V
Type
Flip-Flop
Current(IOH)
5.2mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

74HC14DM/TR 产品概述

一、产品简介

74HC14DM/TR 是华冠(HGSEMI)推出的高速 CMOS 逻辑六反相器(六路施密特触发反相器),属于 74HC 系列。器件集成六个独立的施密特触发反相门,可在宽电源电压范围内工作,适用于信号整形、去抖动、波形转化及低速逻辑驱动等场合。封装为 SOP-14,便于批量贴片与 PCB 布局。

二、主要特点

  • 系列:74HC(高速 CMOS)
  • 输入类型:施密特触发器(提高输入噪声抑制与慢沿响应能力)
  • 通道数:6 个独立反相器
  • 工作电压:2V ~ 6V(适用多种逻辑电平系统)
  • 工作温度:0℃ ~ +60℃(商用等级)
  • 封装:SOP-14(表面贴装)
  • 品牌:HGSEMI(华冠)

三、电气参数与性能

  • 静态电流(Iq):20 µA(典型,静态功耗低)
  • 传播延迟(tpd):30 ns @ VCC=5V,负载电容 47 pF(适合中等速度应用)
  • 输出驱动能力:拉/灌电流 IOH/IOL 均为 5.2 mA(适合驱动小电流负载或作为缓冲使用)
  • 输出电平(样本数据):VOH:4.3V;1.9V;5.8V(视 VCC 与加载条件而异)
  • 低电平幅值(样本数据):VOL:250 mV;250 mV;100 mV(视工作点与负载变化)
    说明:以上 VOH/VOL 数据为典型或样本测值,实际设计中应参考完整数据手册并按具体 VCC、温度和负载校核。

四、封装与引脚

  • 封装类型:SOP-14(便于 SMT 组装)
  • 引脚说明:包含 6 个输入/输出反相对(总计 12 个 I/O 引脚)、VCC 与 GND。常见 PCB 布局建议将 VCC 旁放置 0.1 µF 去耦电容,尽量缩短电源回路以降低噪声与寄生延迟。

五、典型应用场景

  • 机械按键或开关的去抖动与整形(利用施密特特性提升抗抖动能力)
  • 方波/脉冲整形与边沿检测
  • 简单振荡器或 RC 延迟电路的反相器单元
  • 作为 CMOS 逻辑缓冲或小电流驱动器,用于驱动指示灯或下一级逻辑门
  • 不同电压域间的信号整形(在合理 VCC 范围内)

六、使用建议与注意事项

  • 电源去耦:在 VCC 与 GND 之间放置 0.1 µF 陶瓷去耦电容,靠近封装引脚布置。
  • 负载与驱动:输出最大驱动能力约 5.2 mA,驱动更大负载时应增加缓冲器或使用功率更强的器件。
  • 温度与工作电压:器件按 0℃~+60℃ 商用温度区间使用,超出此范围需选用更适合的等级产品。
  • 输入保护:避免将输入悬空,施密特输入可以容忍慢沿,但建议通过上拉/下拉电阻定义初始状态。
  • ESD 与静电防护:在装配与测试过程中注意静电防护,避免损伤器件。

七、品牌与采购

  • 型号:74HC14DM/TR
  • 品牌:HGSEMI(华冠)
  • 适合批量 SMT 生产的 SOP-14 封装,TR 表示带卷带包装(适合贴片机上料)。采购时请确认温度等级、包装形式及所需数据手册以核对电气特性与管脚定义。

总结:74HC14DM/TR 是一款通用性强、功耗低且具有施密特输入的六路反相器,适合信号整形与一般逻辑缓冲应用。在实际设计中请结合完整数据手册核对电平与驱动能力,并按推荐的布线及去耦措施来保证系统稳定性。

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