WMSIC Electronic Components

HGSEMI CD4071BM/TR CD4071BM

ModelCD4071BM/TR
PackageSOP-14
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI CD4071BM / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
CD4071BM/TR
Electronic Component
1
Package
SOP-14
Electronic Component
Logic Gate
Electronic Component
4000
Electronic Component
0.294g
Electronic Component
1
Channel Count
4
Electronic Component
BM0264336347
Operating Temperature
40℃~+85℃
Operating Voltage
3V~15V
Logic Type
Gate
Current(IOH)
6.8mA
Current(IOL)
6.8mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CD4071BM/TR 产品概述

一、概述

CD4071BM/TR 为 HGSEMI(华冠)生产的四路二输入或门(4×2-输入 OR Gate),输出带缓冲,属于经典的4000系列 CMOS 逻辑器件。器件推荐工作电压范围为 3V 至 15V(以 VSS 为参考),适合在宽电源范围内使用,特别适用于工业及汽车电子等对供电灵活性要求较高的场合。未使用的输入脚必须接至 VDD、VSS 或与另一输入短接,以避免不确定状态。

二、主要特性

  • 逻辑类型:或门(OR),4 路、每路 2 个输入
  • 工作电压:3V ~ 15V
  • 极低静态电流:Iq ≈ 1 μA(典型)
  • 输出驱动能力:IOL、IOH 均可达 6.8 mA(典型)
  • 输出缓冲,增强噪声抗扰度并降低输出阻抗变化影响
  • 宽工作温度:-40 ℃ ~ +85 ℃
  • 封装:SOP-14,便于表面贴装组装(TR 表示带卷带包装)

三、电气参数(典型参考)

(以下为典型阈值与输出电平在不同 VDD 下的参考值)

  • VDD = 5V:VIH = 3.5V,VIL = 1.5V,VOH ≈ 4.95 ~ 5V,VOL ≈ 50 mV
  • VDD = 10V:VIH = 7V,VIL = 3V,VOH ≈ 9.95 ~ 10V
  • VDD = 15V:VIH = 11V,VIL = 4V,VOH ≈ 14.95 ~ 15V

注意:阈值随 VDD 线性变化,上述数值为典型值,设计时应参考具体数据手册的最小/最大规格并加入裕量。

四、时序性能

在推动负载为 50 pF 条件下的典型传播延迟(tpd):

  • VDD = 5V:tpd ≈ 250 ns
  • VDD = 10V:tpd ≈ 120 ns
  • VDD = 15V:tpd ≈ 90 ns

对于高速或大电容负载的场合,应考虑器件的速度限制,必要时采用专用缓冲驱动器或降低负载电容。

五、封装与引脚

SOP-14 封装,标准 14 引脚分配包括 8 个输入、4 个输出、VDD 与 VSS。SOP-14 便于表面贴装,适合中小批量生产与自动化贴片。TR 表示卷带包装,利于 SMT 线上料。

六、应用与设计注意事项

  • 推荐在 VDD 与 VSS 之间并联 0.01 μF ~ 0.1 μF 陶瓷去耦电容,靠近芯片电源引脚布置,以抑制瞬态噪声。
  • 未使用输入必须确定电平,否则会造成功耗上升或不稳定输出。
  • 器件为 CMOS 结构,静电敏感,焊接与调试时注意防静电措施。
  • 输出驱动能力有限(典型 6.8 mA),不建议直接驱动大功率负载或长线,如需更大电流应加外部缓冲或驱动器。
  • 适用于逻辑组合、信号合并、隔离与一般控制逻辑,尤其在需要宽电源轨和低待机功耗的工业与汽车电子系统中表现良好。

总结:CD4071BM/TR 提供了宽电源范围、低静态功耗和稳健的输出缓冲特性,是在多种应用场景下实现逻辑或功能的可靠选择。有关精确极限值、功耗与时序的最小/最大规格,请参阅完整数据手册以进行最终设计验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.