WMSIC Electronic Components

HGSEMI CD4011BM/TR CD4011BM

ModelCD4011BM/TR
PackageSOIC-14
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI CD4011BM / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
CD4011BM/TR
Electronic Component
1
Package
SOIC-14
Electronic Component
Logic Gate
Electronic Component
4000
Electronic Component
0.292g
Electronic Component
1
Channel Count
4
Electronic Component
BM0227582620
Operating Temperature
40℃~+85℃
Logic Type
and Gate
Current(IOH)
2.4mA
Current(IOL)
2.4mA
Channel Count
2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CD4011BM/TR 产品概述

一、简介

CD4011BM/TR 是 HGSEMI(华冠)推出的 4000 系列 CMOS 器件,内部包含 4 个独立的两输入与非门(quad 2-input NAND)。器件适用于低功耗、宽电源电压范围的数字逻辑电路,常用于通用逻辑组合、门阵列和接口电路。封装为 SOIC-14,/TR 表示卷带包装(tape & reel),适合量产贴片使用。

二、主要特性

  • 逻辑类型:与非门(NAND),每通道为 2 输入,器件共 4 通道。
  • 工作温度:-40 ℃ ~ +85 ℃(工业级)。
  • 典型静态低功耗,适应宽电源范围(典型 3 V ~ 15 V CMOS 供电)。
  • 封装:SOIC-14(便于表面贴装),/TR 表示卷带包装。
  • 品牌:HGSEMI(华冠),型号:CD4011BM/TR。

三、电气参数(典型值,基于不同 VCC)

  • VCC 工作范围:建议 3 V ~ 15 V(请参考器件规格书以确定极限值)。
  • 输入高电平 (VIH):3.5 V(VCC=5V);7 V(VCC=10V);11 V(VCC=15V)。
  • 输入低电平 (VIL):1.5 V(VCC=5V);3 V(VCC=10V);4 V(VCC=15V)。
  • 输出高电平 (VOH):4.95 V(VCC=5V);9.95 V(VCC=10V);14.95 V(VCC=15V)。
  • 输出低电平 (VOL):典型 50 mV(在规定负载下)。
    注:上述为典型/典型条件值,实际设计时请以厂家正式数据手册为准,并考虑负载电流及温度影响。

四、典型应用

  • 通用逻辑构建(门电路、组合逻辑)。
  • 接口与电平转换(在相容电压范围内)。
  • 可配置逻辑与实验验证电路、原型开发板。
  • 驱动小信号负载、与其他 CMOS 器件配合使用的控制电路。

五、设计与使用注意事项

  • 采用电源旁路电容(0.1 μF 陶瓷)靠近 VCC-GND,以抑制瞬态和干扰。
  • 未使用的输入脚应明确接到高或低电平,避免浮空导致功耗升高或误动作。
  • 输出驱动能力有限,避免直接驱动大电流负载;如需驱动继电器或大电流器件应加缓冲/驱动器。
  • 在不同 VCC 下输入阈值成比例变化,设计时注意与前后级电平兼容性。
  • 考虑静电保护(ESD),在装配与测试过程中采取防静电措施。

六、封装与订购建议

  • 标准封装:SOIC-14,方便 SMT 生产线贴装。
  • 订购型号示例:CD4011BM/TR(华冠,卷带包装),适合批量生产采购。
  • 如需其他包装或温度等级,请与供应商确认具体型号后再行采购。

总结:CD4011BM/TR 以其四路两输入与非门结构、宽电源范围和工业级温度适应性,适合中低速数字逻辑与通用控制电路。设计时注意电源去耦、输入定义及输出驱动限制,以保证可靠性与长期稳定工作。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.