Model & package intelligence
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HGSEMI 74HC165M/TR 74HC165M
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HGSEMI 74HC165M / TR
- Type
- HGSEMI
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- to
- Electronic Component
- Electronic Component
- Electronic Component
- HGSEMI
- Electronic Component
- 74HC165M/TR
- Electronic Component
- 1
- Package
- SOP-16
- Electronic Component
- positions Register
- Electronic Component
- 74HC
- Electronic Component
- 0.319g
- Electronic Component
- 1
- Features
- Electronic Component
- Electronic Component
- BM0227365013
- Operating Temperature
- 40℃~+105℃
- Operating Voltage
- 2V~6V
- Output Current
- 4mA
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
74HC165M/TR（HGSEMI 华冠）产品概述
一、产品简介
74HC165M/TR 是华冠（HGSEMI）生产的 74HC 系列并行输入转串行输出移位寄存器，单片 8 位并行采集、串行输出，封装为 SOP-16，工作电压范围宽（2V～6V），工业级温度范围（-40℃～+105℃），适用于各类数字量扩展与输入扫描场合。
二、核心参数
- 功能：并行至串行（8 位）
- 电压范围：2V～6V
- 每个元件位数：8 bit
- 系列：74HC（CMOS 高速）
- 工作温度：-40℃～+105℃
- 传播延迟 tpd：30 ns @ 4.5V, CL=50 pF
- 输出电流：典型 4 mA（高/低电平驱动能力）
- 封装：SOP-16（管脚兼容常见 74HC165 系列）
- 品牌：HGSEMI（华冠）
三、主要特性与优势
- 低功耗、高速 CMOS 结构，适合低电压系统及电池供电场景；
- 标准 8 位并行输入一次性捕获，再通过时钟序列化输出，便于 MCU 少线控制扩展多个输入；
- 宽温工作性能，适用于工业环境；
- SOP-16 小封装，便于 PCB 密集布线与自动贴装。
四、典型应用场景
- 按键矩阵与开关扫描（减少 I/O 占用）；
- 外围传感器或状态信号集中读取；
- LED 显示或驱动前的串行数据输入（配合移位寄存器链）；
- 工控、仪器仪表、消费电子的输入扩展模块。
五、设计与使用建议
- 电源端加 0.1 μF 陶瓷去耦电容，靠近 VCC-GND 引脚放置；
- 由于输出驱动能力约 4 mA，不能直接驱动大电流负载，需配合驱动器或缓冲器；
- 对长时钟线或高频应用，尽量缩短走线并增加上拉/下拉设置以避免毛刺误触发；
- 并联多个器件时注意级联时钟与串出引脚相序；并行加载（/PL）信号应保证干净的上升/下降沿以确保采样正确；
- 满足传播延迟与时序要求时，请参考实际系统的容性负载（CL）并留有裕量。
六、封装与选型建议
- 标准 SOP-16 封装，适合自动化贴片生产；
- 选型时注意工作电压与环境温度是否匹配目标系统，若需更强驱动或更高温度等级，可参考同系列衍生型号。
本器件以其可靠的并行采样与串行输出能力，配合宽电压与宽温范围，适合各类 I/O 扩展与输入采集需求，是性价比较高的数字输入拓展元件。
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