Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LM2596S-ADJ/TR 是由华冠半导体(HGSEMI)推出的高性能 DC-DC 电源芯片,属于降压型同步整流器系列。该芯片以其高效率、低静态电流和广泛的输入电压范围而受到广泛欢迎,特别适用于各种需要高效能和紧凑设计的电子设备。
LM2596S-ADJ/TR 采用高效的降压拓扑结构,能够在广泛的输入电压范围内提供高效能转换。这种设计确保了在不同负载条件下都能保持较高的转换效率,从而减少热量产生和能量浪费。
该芯片支持 4.5 V ~ 40 V 的输入电压范围,这使得它非常适合用于各种应用场景,例如汽车电子、工业控制系统、通信设备等。这种灵活性使得设计工程师可以更容易地选择适合他们项目的电源解决方案。
LM2596S-ADJ/TR 提供可调输出功能,允许用户通过外部分压器网络来设置所需的输出电压。这一特性使得该芯片可以适应多种不同的应用需求,无需更换不同的固定输出电压版本。
在待机或低负载状态下,LM2596S-ADJ/TR 的静态电流仅为 5 mA。这对于需要长时间运行但又希望降低能耗的设备来说是一个重要优势,特别是在便携式电子设备或低功耗系统中。
该芯片能够在 -40℃ ~ +125℃ 的广泛温度范围内正常工作,这使得它非常适合用于恶劣环境下的应用,如汽车电子、工业控制等领域。
LM2596S-ADJ/TR 内置了高性能的开关管,这简化了外部元件的选择和布局,同时也提高了整体系统的可靠性和稳定性。
该芯片采用 TO-263-5 封装,这是一种常见且易于焊接的封装形式,方便集成到各种 PCB 设计中。
汽车电子:
工业控制系统:
通信设备:
便携式电子设备:
服务器和数据中心:
LM2596S-ADJ/TR 是一款功能强大、性能优异的 DC-DC 电源芯片,通过其高效能转换、宽输入电压范围、可调输出以及低静态电流等特点,广泛适用于各种电子设备和系统。其标准封装形式和易于集成的设计,使其成为许多工程师首选的电源解决方案。通过正确选择和使用此芯片,可以实现高效、可靠且紧凑的电源设计。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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