WMSIC Electronic Components

HGSEMI AD8552M/TR AD8552M

ModelAD8552M/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI AD8552M / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
AD8552M/TR
Electronic Component
1
Package
SOP-8
Electronic Component
Precision Op Amp
Electronic Component
0.19g
Electronic Component
1
Electronic Component
Output
Features
EMI / RF
Electronic Component
BM0227597201
Operating Temperature
40℃~+85℃
Output Current
65mA
(SR)
0.95V/us
Power Supply Voltage
1.8V~5.5V
Static Current(Iq)
180uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AD8552M/TR 产品概述

一、概述

AD8552M/TR 是华冠(HGSEMI)推出的一款高性能双路运算放大器,属于轨到轨输入/轨到轨输出(RRIO)类型,适用于低电压、低功耗和高精度的模拟前端设计。该器件提供极低的输入失调、电流漂移以及优良的共模抑制,兼顾驱动能力与能耗控制,适合便携式设备、传感器接口及精密信号调理场合。

二、主要性能参数

  • 共模抑制比(CMRR):110 dB(典型)
  • 轨到轨:输入轨到轨,输出轨到轨
  • 电源电压范围:
    • 单电源:1.8 V ~ 5.5 V
    • 双电源:Vee ~ Vcc 为 900 mV ~ 2.75 V,或 -2.75 V ~ -900 mV
    • 最大电源宽度(Vdd - Vss):5.5 V
  • 输入失调电压(Vos):5 μV(典型)
  • 输入偏置电流(Ib):20 pA
  • 输入失调电流(Ios):10 pA
  • 输入失调电压温漂(Vos TC):10 nV/°C
  • 增益带宽积(GBP):1.8 MHz
  • 压摆率(SR):0.95 V/μs
  • 静态电流(Iq):180 μA(每通道)
  • 输出电流能力:65 mA
  • 工作温度范围:-40 °C ~ +85 °C
  • 封装:SOP-8

三、关键特性与优势

  • 极低失调及漂移:5 μV 的输入失调与极低温漂可减少前置放大器的误差积累,适合要求高精度的测量系统。
  • 宽供电与轨到轨能力:支持 1.8 V 单电源工作并实现输入/输出靠近电源轨,便于低功耗便携设备设计。
  • 高 CMRR:110 dB 提高差分信号测量的抗干扰能力,适合差分传感器与仪表放大。
  • 良好驱动能力:65 mA 输出电流可直接驱动一定负载,适用于驱动采样保持电容或较低阻抗负载。
  • 低功耗:每对通道静态电流 180 μA,兼顾续航与性能。

四、典型应用

  • 便携式医疗设备与生物电测量前端
  • 传感器信号调理(温度、压力、称重传感器)
  • 精密数据采集系统与仪表放大器
  • 低电压供电的电池驱动设备
  • 电平移位与缓冲驱动

五、封装与布局建议

  • 封装为 SOP-8,适合常规 PCB 装配工艺;注意焊盘和散热层设计以保证热阻和可靠性。
  • 电源旁应放置适当的去耦电容(如 0.1 μF 片式陶瓷并联 10 μF),尽量靠近电源引脚布置以减少电源噪声。
  • 输入端采用低泄漏走线和短回路,避免长而未屏蔽的输入路径以降低偏置电流引起的误差。
  • 对于驱动电容性负载时,建议在输出与负载之间加入串联电阻以保证稳定性。

六、使用注意事项

  • 虽具轨到轨能力,但在极端靠近电源轨时可能存在大信号失真,设计时预留一定裕量以保证线性度。
  • 在高速或大负载切换应用中关注瞬态响应与纹波,必要时增加电源滤波与局部缓冲。
  • 环境温度变化剧烈时,应验证温漂性能以满足系统精度要求。

七、选型与替代建议

AD8552M/TR 适合在低电压、高精度与中等带宽场景替代主流的低功耗运放。若需更高带宽或更大压摆率,可对比市场上更高 GBP 的器件;若更注重超低噪声或超低漂移,应在系统层面权衡性能与功耗。

如需样片或批量采购,请通过华冠(HGSEMI)官方渠道确认产品型号、封装与供货周期。

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