WMSIC Electronic Components

HGSEMI MAX3485EIMM/TR MAX3485EIMM

ModelMAX3485EIMM/TR
PackageMSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI MAX3485EIMM / TR
Type
HGSEMI
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
MAX3485EIMM/TR
Electronic Component
1
Package
MSOP-8
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.15g
Electronic Component
256
Electronic Component
1
Features
Tx / Rx;;;; Low Power
Electronic Component
BM0264801278
Operating Temperature
40℃~+85℃
Operating Voltage
3V~3.6V
Receiver
1
Data
12Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MAX3485EIMM/TR 产品概述

一、产品简介

MAX3485EIMM/TR(华冠 HGSEMI)是一款符合 TIA/EIA-485 标准的单通道 RS-485 半双工收发器,工作电压范围为 3.0V 至 3.6V(典型 3.3V)。器件集成一个驱动器和一个接收器,具有低功耗特性,并提供多重保护与控制功能,适用于工业级总线通信场景。封装为 MSOP-8,工作温度覆盖 -40℃ 至 +85℃,可在严苛环境中稳定运行。

二、主要规格

  • 类型:收发器(Transceiver)
  • 驱动器数:1;接收器数:1(半双工)
  • 工作电压:3.0V ~ 3.6V(3.3V 供电)
  • 数据速率:高达 12 Mbps
  • 总线节点数:支持多达 256 节点
  • 静电保护:±15 kV(HBM 等级)
  • 工作温度:-40℃ ~ +85℃
  • 静态电流:800 μA(待机/静态条件)
  • 通讯模式:半双工
  • 封装:MSOP-8
  • 品牌:HGSEMI(华冠)

三、关键特性说明

  • Tx/Rx 独立使能:驱动器与接收器可独立使能与关闭,便于在多节点网络中实现地址化和节能管理。
  • 低功耗模式:在空闲或待机时可进入低功耗状态,静态电流约 800 μA,有助于延长电源受限系统的运行时间。
  • 过流保护:内置过流检测与限制,能够在短路或总线冲突时限制电流,保护器件与外部电路。
  • 热关断保护:当器件内部温度异常上升时自动关断,防止热失控并提高可靠性。
  • 使能关断(Shutdown):提供外部使能控制,实现快速断电或进入极低功耗状态。
  • 符合 TIA/EIA-485:电气特性与接口兼容工业标准,总线互联可靠。
  • 抗静电能力强:高达 ±15 kV 的静电保护,适合现场布线与频繁插拔场合。

四、典型应用

  • 工业自动化现场总线(PLC、DCS 节点通信)
  • 楼宇自动化与控制系统(门禁、照明控制、暖通)
  • 仪器仪表与数据采集(传感器网络、远程测量)
  • 计量与能源管理(电表、逆变器监控)
  • 电机控制与驱动系统(低速控制总线)
  • 任何需要 3.3V 供电、半双工差分通信的嵌入式系统

五、设计与布局建议

  • 总线终端匹配:在总线两端使用合适的差分终端电阻(常见 120 Ω)以减少反射,终端电阻应靠近收发器放置。
  • 偏置与失效保护:为保证在总线空闲时的定义电平,使用弱偏置(pull-up/pull-down)或专用偏置网络确保接收器不会在浮空时误判。
  • 差分线对布线:保持 A、B 两线对长度一致、间距固定,尽量采用差分对走线并靠近接地平面,以降低干扰与串扰。
  • 保护元件:在工业现场可增加浪涌抑制(TVS 二极管)、共模滤波器或串联限流器以提高系统抗干扰与保护能力。
  • 热与散热考虑:若长时间在高负载或多节点冲突状况下工作,留意器件周围散热空间,配合 PCB 铜面散热设计有助于避免热关断触发。
  • 电源去耦:靠近器件的 VCC 与 GND 引脚处放置 0.1 μF 旁路电容,必要时增加 1 μF~10 μF 以稳定 3.3V 电源。

六、封装与订购信息

  • 封装类型:MSOP-8(小尺寸、适合密集 PCB 布局)
  • 标识型号:MAX3485EIMM/TR(HGSEMI 华冠出品)
  • 适用焊接工艺:兼容回流焊工艺;注意焊盘与焊膏量的标准化以保证可靠焊接。

七、优势总结

MAX3485EIMM/TR 在 3.3V 低电压系统中提供高达 12 Mbps 的半双工差分通信能力,支持多达 256 节点并具备强大的保护功能(过流、热关断、ESD)。其独立的 Tx/Rx 使能与低功耗特性非常适合需要能耗管理与多节点控制的工业与楼宇自动化应用。MSOP-8 小封装便于在空间受限的板级设计中使用,是一款兼顾性能与可靠性的 RS-485 收发器参考选择。

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