WMSIC Electronic Components

HGSEMI CD4518BE

ModelCD4518BE
PackageDIP-16
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI CD4518BE
Type
HGSEMI
Minimum package
1000 盒

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
CD4518BE
Electronic Component
1
Package
DIP-16
Electronic Component
Counter / Divider
Electronic Component
1.685g
Electronic Component
2
Electronic Component
1
Features
positions;; Synchronous
Electronic Component
BM0227559682
Reset
Electronic Component
Operating Temperature
40℃~+85℃
Electronic Component
6MHz
Electronic Component
Electronic Component
Electronic Component
Synchronous

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CD4518BE 产品概述

一、产品简介

CD4518BE(HGSEMI/华冠)为双路四位BCD向上计数器,适用于十进制计数与计数级联场合。每路由4位二进制位组成,计数方向为向上计数,计时采用同步方式以保证并行输出间的确定性,并提供异步复位功能以满足快速清零需求。器件采用DIP-16封装,工作温度范围为-40℃至+85℃,便于在工业级环境中长期可靠使用。

二、关键参数

  • 计数速率:最高可达6 MHz(受系统负载、电源及温度影响)
  • 每个元件位数:4 位(BCD 编码)
  • 元件数:2(双通道)
  • 触发沿:支持上升沿/下降沿触发信号(兼容多种时钟源)
  • 计时方式:同步计数,保证并行输出稳定
  • 复位方式:异步复位,立即清零
  • 传播延迟(tpd):典型 160 ns
  • 封装:DIP-16
  • 工作温度:-40℃ ~ +85℃

三、功能特性与应用场景

CD4518BE 专为十进制计数设计,典型应用包括:

  • 数字仪表与计数器(计数事件、来料统计等)
  • 数码管/LED 显示驱动(与译码器配合调用BCD输出)
  • 频率分频与脉冲处理
  • 时序逻辑与控制系统中的十进制计数段 双通道设计便于两位并行或独立计数,利于模块化设计与级联扩展。

四、设计与使用建议

  • 时钟源:为获得稳定的计数性能,应使用干净的方波脉冲并做好去抖处理;若为机械开关,建议加消抖电路或使用缓冲器。
  • 复位控制:异步复位能即时清零,使用时注意异步信号的毛刺可能导致误复位,建议在复位线上加入必要的滤波或保持电平。
  • 级联计数:多位十进制计数可通过级联多片CD4518实现,级联时注意时序匹配与进位逻辑的连接方式,避免竞态。
  • 电源与布局:对电源进行去耦(例如在VCC与GND之间并联0.1 μF 陶瓷电容),时钟与高速信号走线应尽量短且远离噪声源,以减少干扰和传播延迟抖动。
  • 性能余量:虽然标称计数速率为6 MHz,但在实际系统中应考虑负载、温度及供电条件,预留一定余量以确保稳定运行。

五、注意事项与资料获取

  • 在实际设计前请参考厂商完整数据手册以获取精确引脚定义、电气特性曲线及典型应用电路。
  • 在高温或高频应用场景下,关注传播延迟与建立保持时间要求,必要时做仿真验证。
  • 选型时确认封装(DIP-16)与PCB布局兼容,量产时可考虑SOP等表面贴装封装以利于自动化装配。

本概述以CD4518BE 的核心参数为基础,侧重实用设计要点与应用建议,便于在系统设计与调试阶段快速把握该器件的能力与限制。如需引脚图、电气参数表或典型接线图,请提供具体数据手册版本或联系供应商获取完整资料。

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