WMSIC Electronic Components

HGSEMI LM2594M-3.3/TR LM2594M

ModelLM2594M-3.3/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM2594M-3.3 / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LM2594M-3.3/TR
Electronic Component
1
Package
SOP-8
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.077g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227677195
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
4.5V~60V
Switching Frequency
150kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM2594M-3.3/TR 产品概述

一、概述

LM2594M-3.3/TR 为降压型(Buck)开关稳压器,品牌:HGSEMI(华冠),封装为 SOP-8。器件内置功率开关,输出为固定 3.3V,适合从宽输入电压(4.5V~60V)降压到 3.3V 的应用。最大输出电流 500mA,开关频率为 150kHz,静态电流仅 85µA,工作结温范围 -40℃~+125℃(TJ)。该器件为非同步整流结构,单通道输出,适合对效率、尺寸与成本有平衡要求的中低功率电源设计。

二、主要规格要点

  • 输入电压范围:4.5V ~ 60V
  • 输出电压:固定 3.3V
  • 输出电流:最大 500mA
  • 开关频率:150kHz
  • 静态电流(Iq):85µA(典型)
  • 同步整流:否(需外接肖特基二极管)
  • 内置开关管,封装:SOP-8,单路输出
  • 工作温度:-40℃ ~ +125℃(TJ)

三、典型特性与优势

  • 宽输入电压,适配汽车、工业与通信电源总线输入。
  • 低静态电流,适合电池供电或待机功耗敏感的场合。
  • 内置开关器件,简化系统设计,节省外部元件数量与PCB面积。
  • SOP-8 兼顾散热与成本,适合批量化生产与通用电源模组。

四、应用场景

  • 汽车电子(车载辅助电源、传感器供电)
  • 工业控制(传感器、通讯模块)
  • 通信设备和嵌入式系统的 3.3V 供电
  • 电池供电系统与备用电源模块

五、设计与选型建议

  • 整流二极管:因为为非同步结构,建议选用低正向压降的肖特基二极管,额定反向耐压 ≥ 输入最大电压,正向电流额定值 ≥ 输出电流。
  • 电感选择:按期望电流纹波 20%~40% 的峰峰值选择电感。可用公式 L = Vout*(Vin−Vout)/(VinΔIFs) 估算,其中 Fs=150kHz,ΔI 为目标电流纹波。
  • 输入/输出电容:优先低 ESR 型电解或陶瓷(X7R/NP0)电容,输入侧靠近器件放置以降低纹波。
  • PCB 布局:开关节点(SW)、二极管和电感间走线尽量短且宽,输入地与输出地分区处理,增加散热铜箔以帮助热量扩散。
  • 散热与可靠性:高输入/高输出功率工况下注意热耗散,必要时在 SOP-8 下方增加焊盘并连大面积铜箔以提升热能力。

六、注意事项

  • 器件为非同步整流,轻载效率受肖特基二极管损耗影响;对极致高效要求可考虑同步整流方案。
  • 具体保护特性(如过流、过温)与器件版本有关,设计前请参考完整数据手册并进行可靠性验证。

如需参考典型外部元件清单、滤波/软启动/散热布局示意或仿真模型,可进一步提供输入电压范围、输出峰值功率与 PCB 限制,以便给出更详尽的设计方案。

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