WMSIC Electronic Components

HGSEMI HGSP3485EIMM/TR HGSP3485EIMM

ModelHGSP3485EIMM/TR
PackageMSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI HGSP3485EIMM / TR
Type
HGSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
HGSP3485EIMM/TR
Electronic Component
1
Package
MSOP-8
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.259g
Electronic Component
256
Electronic Component
1
Features
Tx / Rx;; Low Power
Electronic Component
BM0264548218
Operating Voltage
5V;3V
Receiver
1
Data
10Mbps
Static Current
630uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HGSP3485EIMM/TR — RS-485 收发器产品概述

一、产品简介

HGSP3485EIMM/TR 是华冠(HGSEMI)推出的一款高可靠性 RS-485 半双工收发器,单路驱动器与单路接收器配置(1Tx/1Rx),封装为 MSOP-8,适合空间受限的工业与楼宇控制应用。器件支持 3V/5V 工作电压范围,最大数据速率可达 10 Mbps,能够在多点总线上支持多达 256 个节点布局;静态电流仅 630 μA,兼顾性能与低功耗。器件提供 ±15kV 的静电防护能力,增强系统抗干扰与可靠性。

二、主要功能与特点

  • 单驱动器、单接收器(1Tx/1Rx),满足常见 RS-485 通讯拓扑。
  • 宽电压兼容:支持 3V 与 5V 电源,便于与多种 MCU/逻辑电平直接接口。
  • 高速通讯:最高支持 10 Mbps,适用于实时性要求较高的工业总线。
  • 多节点支持:设计可支持至多 256 个节点的多点结构。
  • 低功耗:静态电流典型值 630 μA;具备低功耗模式及使能关断功能。
  • 控制引脚:Tx/Rx 启用控制,便于总线仲裁与节能管理。
  • 强抗干扰:器件经优化具备 ±15kV 静电放电保护,提升现场可靠性。
  • 紧凑封装:MSOP-8 小封装,适合密集布板与小型化设备。

三、电气与可靠性指标概览

器件工作电压覆盖常见系统电平(3V 与 5V),在额定条件下可提供 10 Mbps 传输速率;待机或关闭使能时静态电流约为 630 μA,适合常电在线但要求低待机功耗的场景。静电防护等级达到 ±15kV(典型 IEC 61000-4-2 等级),提高了安装和维护时的抗损伤能力。支持多节点 RS-485 网络,便于大规模分布式系统设计。

四、设计与使用建议

  • 总线终端:在差分总线两端采用合适阻值终端电阻(常见 100–120 Ω)以避免信号反射。
  • 总线偏置:为保证空闲时总线电平确定,建议在主控端设置弱上拉/下拉偏置电阻或采用偏置网络。
  • PCB 布局:差分对尽量等长并保持走线靠近,避免长分支线(stub)引入反射与串扰。
  • 保护措施:在工业环境建议外加 TVS 或浪涌抑制器件,配合器件自身 ±15kV ESD 能力,提升系统稳健性。
  • 电源去耦:VCC 旁近端放置 0.1 μF 陶瓷电容以抑制瞬态噪声。
  • 使能管理:合理利用 Tx/Rx 使能与关断功能,避免总线争用并在空闲时降低功耗。

五、典型应用场景

  • 工业自动化与 PLC 通讯节点
  • 楼宇自动化与安防联网设备
  • 电力与仪表抄表系统(智能电表、集中器)
  • 电机控制与现场总线接口模块
  • 嵌入式多节点数据采集与远程 IO 模块

六、封装与订购提示

HGSP3485EIMM/TR 为 MSOP-8 小型封装,型号后缀 TR 通常表明卷带包装(Tape & Reel),便于自动贴片生产。选型时请确认工作电压等级与封装形式以匹配生产与库存需求。

总结:HGSP3485EIMM/TR 在小型封装下提供高速、低功耗与强抗扰能力,是工业与楼宇多点 RS-485 网络中兼顾密度与可靠性的实用型收发器。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.