WMSIC Electronic Components

HGSEMI CD4070BM/TR CD4070BM

ModelCD4070BM/TR
PackageSOP-14
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI CD4070BM / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
CD4070BM/TR
Electronic Component
1
Package
SOP-14
Electronic Component
Logic Gate
Electronic Component
4000
Electronic Component
0.3g
Electronic Component
1
Channel Count
4
Electronic Component
BM0227677198
Operating Temperature
40℃~+85℃
Operating Voltage
3V~15V
Logic Type
Gate
Current(IOH)
4.2mA
Channel Count
2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CD4070BM/TR 产品概述

一、概述

CD4070BM/TR(HGSEMI 华冠)为四路二输入异或门(Quad 2-Input Exclusive-OR),属于经典的 4000 系列 CMOS 逻辑器件。器件工作电压范围宽(3V~15V),适用于各种单电源或多电源系统,耐温范围为 -40℃ 到 +85℃,适合工业级应用与通用数字电路设计。

二、主要特性

  • 逻辑类型:异或门(XOR),四通道(4 gates),每通道两输入。
  • 封装:SOP-14,便于表面贴装与自动化装配。
  • 工作电压:3V ~ 15V,兼容多种电平标准。
  • 静态电流(Iq):典型 60 μA(低功耗设计,静态消耗小)。
  • 传播延迟(tpd):100 ns(在 VDD=15V、Cload=50 pF 条件下)。
  • 输出高电平(VOH):约 4.95V(VDD=5V)、9.95V(VDD=10V)、14.95V(VDD=15V)。
  • 输出低电平(VOL):典型 50 mV。
  • 输出拉电流(IOH):典型 4.2 mA(高电平输出驱动能力参考值)。
  • 输入阈值(逻辑高/低):
    • VIH(需判定为高电平):约 3.5V @ VDD=5V;7V @ VDD=10V;11V @ VDD=15V。
    • VIL(判定为低电平):约 1.5V @ VDD=5V;3V @ VDD=10V;4V @ VDD=15V。

三、应用场景

  • 数字信号比较、相等/不等检测电路。
  • 奇偶校验生成/检测与数据编码/解码。
  • 可编逻辑、门阵列外围逻辑、时序电路中作为组合逻辑单元使用。
  • 工业控制、通信子系统、低速数据处理等要求低功耗且工作电压范围宽的场合。

四、设计与使用建议

  • 电源去耦:为保证稳态与高速转换性能,建议在 VDD 与 GND 之间并接 0.01–0.1 μF 陶瓷去耦电容,贴近芯片电源脚。
  • 输入不要浮空:CMOS 输入浮空会引起不确定状态与功耗上升,应通过上拉/下拉或明确驱动。
  • 负载与延迟:传播延迟受输出负载电容影响明显,Cload 增大时延增加;设计时按 50 pF 条件下 tpd=100 ns 为参考。
  • 电平兼容:在不同 VDD 下的 VIH/VIL 明确列出,外部接口需保证信号电平在对应阈值范围内,避免亚稳态。
  • 温度与可靠性:器件工作温度 -40℃~+85℃,在极端环境下注意热管理与布局。
  • ESD/工艺:表面贴装器件在搬运与焊接时注意防静电与温度曲线要求,确保良好焊接质量。

五、封装与订购信息

  • 品牌:HGSEMI(华冠)
  • 型号:CD4070BM/TR
  • 封装:SOP-14(四路二输入 XOR,4000 系列)

CD4070BM/TR 以其宽电源范围、低静态功耗和稳定的逻辑特性,适合在通用数字电路与低速逻辑系统中替代或实现异或功能。设计时请参考上述阈值与驱动能力参数,配合合理的 PCB 布局与去耦措施以获得最佳性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.