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HGSEMI TDA2822M/TR TDA2822M
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HGSEMI TDA2822M / TR
- Type
- HGSEMI
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HGSEMI
- Electronic Component
- TDA2822M/TR
- Electronic Component
- 1
- Package
- SOP-8
- Electronic Component
- Audio Power Amplifier
- Electronic Component
- 0.248g
- Electronic Component
- 1
- Features
- Built-in Audio; / Switch
- Electronic Component
- BM0226614590
- Operating Temperature
- 0℃~+70℃
- Operating Voltage
- 1.8V~12V
- Output Power
- 1300mW×2@8Ω；650mW×2@4Ω；380mW×2@8Ω
- Static Current(Iq)
- 6mA
- Speaker Channel Count
- Electronic Component
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDA2822M/TR 产品概述
一、产品简介
TDA2822M/TR 是华冠（HGSEMI）提供的一款双通道单片音频功率放大器，适用于 12V 供电系统的音频驱动应用。器件集成度高、静态电流低，采用 SOP-8 封装，便于在消费电子、嵌入式音频和电源空间受限的场合进行电路布局与量产装配。
二、主要规格参数
- 工作电压：1.8V ～ 12V（推荐在 12V 系统中驱动较大负载）
- 工作温度：0℃ ～ +70℃
- 静态电流（Iq）：典型 6mA
- 电源纹波抑制比（PSRR）：典型 40dB（低频）或约 30dB（较高频段）
- 封装形式：SOP-8
（以上为器件典型性能，具体极限参数与特性曲线请参考数据手册）
三、功能与特点
- 双通道输出，单片集成，减少外部器件数量与 PCB 面积。
- 低静态电流设计，有助于降低系统空载功耗。
- 良好的电源纹波抑制能力，能在有一定纹波的供电环境下保持较低的噪声注入。
- SOP-8 封装适合自动化贴装，利于中小批量生产与成本控制。
四、典型应用场景
- 便携式音箱与迷你音响系统（在 12V 汽车或 DC 供电环境下）
- 收音机、电视、机顶盒等消费类音频输出端
- 儿童玩具、门铃、对讲机与音频提示器
- 嵌入式开发板、模块化音频单元的驱动部分
五、设计与使用建议
- 电源旁路：在 VCC 引脚近侧并联一只 0.1µF 陶瓷电容与一只 10µF～100µF 电解电容，以抑制高低频纹波与瞬态电流。
- 地线处理：优先采用地平面或单点回流，减少地阻抗引入的干扰。
- 散热考虑：尽管器件功耗在中低档，但在 12V 高电压与低阻抗负载时芯片发热明显，建议预留散热空间或在 PCB 上加大铜箔面积。
- 输出配置：根据系统架构选择单端耦合或桥接输出方式；若采用单端驱动注意耦合电容的容量以保证低频响应。
- 增益与滤波：输入端可增加 RC 滤波、增益控制电路，以优化频响与抑制杂讯。
六、可靠性与环境适配
器件额定工作温度为 0℃～+70℃，适合多数室内与车载轻工业环境。为保证长期可靠性，建议避免在极限温度、强振动或严重电磁干扰环境下长期工作，并在设计时留有一定余量（电压、温度）。
七、选型建议
若系统重点为低功耗与小体积，且工作环境在额定温度范围内，TDA2822M/TR 因其低静态电流、良好 PSRR 与 SOP-8 封装，是成本敏感型音频方案的合适选择。若需更高功率或宽温度范围，请同时参考厂商更高等级或具备加强散热能力的同类器件。
如需数据手册、典型应用电路或 PCB 布局示例，可提供具体电路需求与负载条件，我可以协助给出更详细的参考方案。
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