WMSIC Electronic Components

HGSEMI LM2575T-5.0 LM2575T

ModelLM2575T-5.0
PackageTO-220-5
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM2575T-5.0
Type
HGSEMI
Minimum package
1000 盒

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LM2575T-5.0
Electronic Component
1
Package
TO-220-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
2.8g
Electronic Component
1
Type
Electronic Component
Electronic Component
BM0229934255
Operating Temperature
0℃~+85℃@(TJ)
Operating Voltage
4.75V~40V
Switching Frequency
52kHz
Electronic Component
Electronic Component
Output Voltage
5V
Output Current
1A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM2575T-5.0 产品概述

一、产品简介

LM2575T-5.0 是一款降压型(Buck)开关稳压器,适用于将4.75V40V 输入电压转换为固定5V 输出,最大输出电流为1A。器件采用内置开关管设计,开关频率约为52kHz,静态电流(Iq)约为10mA,单通道输出,封装为 TO-220-5,工作结温范围为 0℃+85℃(TJ 标称)。该器件定位于低外设元件数、外形紧凑且具备良好热性能的中小功率电源方案。

二、主要参数

  • 功能类型:降压型(Buck)
  • 输入电压范围:4.75V ~ 40V
  • 输出电压:固定 5.0V
  • 最大输出电流:1A
  • 开关频率:52kHz(典型值)
  • 静态电流(Iq):约 10mA
  • 开关管:内置
  • 输出类型:固定输出
  • 输出通道数:1
  • 拓扑结构:降压式
  • 工作温度:0℃ ~ +85℃(TJ)
  • 封装:TO-220-5
  • 品牌:HGSEMI(华冠)

三、功能与特点

  • 内置开关晶体管,简化外部元件和PCB布局,便于实现紧凑电源设计。
  • 固定 5V 输出版本免去外部反馈电阻配对,便于批量化应用。
  • 52kHz 工作频率在磁性元件和输出电容的体积与开关损耗之间取得平衡,有利于成本与效率优化。
  • 低静态电流有利于休眠或空载时的功耗控制(但并非超低功耗器件)。
  • 具备常见的保护机制(如限流与热关断),在异常条件下提高系统可靠性(建议参照器件具体资料确认)。

四、典型应用场景

  • 工业控制与仪器仪表:可从24V/48V 工业母线降压到 5V 为逻辑与外围供电。
  • 汽车与车载电子(需注意车规要求与额外浪涌保护):适用于 12V/24V 电源系统的局部稳压(需评估温度与瞬态)。
  • 通信设备与消费电子:为 MCU、传感器以及接口电路提供稳定的 5V 电源。
  • 电池供电系统:在电池电压范围内提供稳压输出(注意效率与散热设计)。

五、外部元件与参考设计要点

  • 必需外部器件通常包括:功率电感、肖特基整流二极管、输入与输出电容(低 ESR 推荐),以及必要的滤波/退耦电容。
  • 选择电感时需兼顾电流承载能力、饱和特性和纹波要求;对 1A 负载应留有裕量。
  • 肖特基二极管需保证反向耐压与连续电流能力高于工作电流,且正向压降尽可能低以提高效率。
  • 输入电容应靠近 VIN 引脚放置以抑制瞬态尖峰;开关节点到肖特基二极管与电感之间的走线应尽量短且宽。

六、热设计与封装注意事项

  • TO-220-5 封装具有良好的散热能力,但在接近 1A 输出或高输入电压、低占空比时器件功耗会上升,需评估结温并视情况使用散热片或良好铜箔散热。
  • PCB 布局中应使用尽量大的铜面积做散热和低阻抗地,同时保证开关回路最短以降低 EMI。
  • 在高温或高功率工作工况下,注意留有热降额空间,确保长期可靠性。

七、选型与使用建议

  • 若应用对效率、EMI 或封装尺寸有更高要求,可比较更高频率或同步整流的降压方案;若需车规级或更宽工作温度,应选择对应等级器件。
  • 设计前请参考完整数据手册与典型应用电路,按照推荐元件值和布局规则实现,以确保稳定与可靠运行。
  • 在批量应用前进行整机温升测试、输入浪涌与输出短路测试,验证在目标工况下的热和电气安全裕度。

如需针对具体输入电压、负载条件的典型电感、电容与肖特基型号推荐或参考电路图,我可以根据您的工况提供详细选型与布板建议。

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