WMSIC Electronic Components

HGSEMI MC1403BM/TR MC1403BM

ModelMC1403BM/TR
PackageSOIC-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI MC1403BM / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
MC1403BM/TR
Electronic Component
1
Package
SOIC-8
Electronic Component
Voltage Reference IC
Electronic Component
±1%
Electronic Component
0.227g
Electronic Component
1
Electronic Component
BM0227699426
Operating Temperature
40℃~+85℃
Operating Voltage
4.5V~40V
Electronic Component
40ppm/℃
Output Voltage
2.5V
Output Current
10mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MC1403BM/TR 产品概述

一 产品简介

MC1403BM/TR(品牌:HGSEMI / 华冠)是一款固定输出型低功耗精密电压源,输出电压2.5V,适用于对基准电压精度和长期稳定性有要求的模拟与数模混合系统。器件封装为SOIC-8,工作温度范围为-40℃至+85℃,适合工业级应用。

二 主要参数与性能要点

  • 输出类型:固定(2.5V)
  • 工作电压范围:4.5V ~ 40V
  • 输出电流:最大可提供10mA(外部负载电流)
  • 静态电流(Iq):典型1.2mA(器件本身工作电流)
  • 精度(初始误差):±1%
  • 温度系数:40ppm/℃(对应于2.5V时约0.1mV/℃)
  • 工作温度:-40℃ ~ +85℃
  • 封装:SOIC-8(MC1403BM/TR 表示带卷带包装)

三 优势与适用场景

MC1403BM/TR具有宽输入电压范围和较低静态电流,适合用作ADC、DAC、传感器前端、基准源和精密测量电路的参考电压。±1%的初始精度配合40ppm/℃的温漂,能在温度变化和电源波动下提供稳定的2.5V参考。

四 设计与使用建议

  • 供电与散热:在高输入电压与大负载电流条件下,器件功耗增加。估算功耗可近似按 (Vin - Vout) × Iout + Vin × Iq 计算。若在40V输入、10mA负载情形下,需注意器件及PCB散热,推荐加大铜箔面积或使用散热通孔。
  • 旁路与滤波:建议在输入端和输出端各并联0.1µF陶瓷旁路和1µF以上的低ESR电容以降低噪声与抑制瞬态。若用于高精度测量,输出端可适当增加滤波网络以降低带宽与噪声。
  • 负载要求:器件能驱动最多10mA的负载,超出时会影响输出精度与稳定性;输出端避免直接短路。
  • 引脚与布局:SOIC-8封装请将参考地(GND)设计为固体地平面,输出到ADC或其他敏感节点的走线应最短,避免通过噪声源区域。

五 典型应用

  • 精密模数转换(ADC)参考电源
  • 数模转换器(DAC)参考
  • 传感器偏置与零点校准
  • 便携及工业测量仪器的基准源

六 封装与订购信息

  • 封装形式:SOIC-8
  • 型号说明:MC1403BM/TR,后缀/TR 表示卷带(Tape & Reel)包装,适合贴片生产线。
  • 工作温度:-40℃~+85℃,工业级规格。

如需更详细的针脚排列、电气特性曲线或典型应用电路图,请提供具体的电路工作点(输入电压、负载、电源噪声等),可据此给出更精确的布局和电磁兼容建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.