WMSIC Electronic Components

HGSEMI LMV324M/TR LMV324M

ModelLMV324M/TR
PackageSOP-14
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LMV324M / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LMV324M/TR
Electronic Component
1
Package
SOP-14
Electronic Component
Operational Amplifier
Electronic Component
0.293g
Electronic Component
1
Electronic Component
Output
Features
Built-in
Electronic Component
BM0265070253
Operating Temperature
45℃~+85℃
Amplifier
4
Output Current
23mA
(SR)
520V/ms
Power Supply Voltage
2.1V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LMV324M/TR 产品概述

LMV324M/TR 是华冠(HGSEMI)推出的四路轨到轨输入/输出、低功耗电压反馈运算放大器,基于 LMV321/LMV358/LMV324 系列设计。该器件为单片四路放大器,封装为 SOP-14,提供卷带(Tape & Reel)出货形式(TR),适合批量表面贴装生产。器件内置补偿,适合单位增益及常见闭环配置,能够在便携和电池供电系统中实现稳定、低功耗的信号调理。

一、主要特性概览

  • 轨到轨输入与轨到轨输出,输入共模范围和输出摆幅接近电源轨,便于低电压系统设计。
  • 单电源工作电压范围:2.1V 至 5.5V(推荐);器件最大允许电源差可达 7.5V。
  • 低静态电流:每通道静态电流典型值 40 µA,适合低功耗应用。
  • 增益带宽积(GBW):1 MHz,适用于一般通用放大与滤波。
  • 压摆率(SR):520 V/ms,响应速度良好。
  • 输出驱动能力:典型输出电流 23 mA,可驱动中等负载。
  • 内置补偿,适合单位增益稳定应用。

二、关键电性能指标

  • 输入失调电压 Vos:典型 800 µV,温漂(Vos TC)约 5.6 µV/℃,适合对直流精度有一定要求的场合。
  • 输入偏置电流 Ib、输入失调电流 Ios:典型 1 pA,便于高阻抗传感器接口。
  • 输入电压噪声密度 eN:27 nV/√Hz @ 1 kHz,噪声性能适合音频及普通精密测量。
  • 共模抑制比 CMRR:约 70 dB。
  • 工作温度范围:-45 ℃ 至 +85 ℃,覆盖工业级温度范围。

三、典型应用场景

  • 便携式音频前端与立体声收录机的缓冲与增益级。
  • 低功耗传感器接口(光电、电容、热敏等)与高阻抗信号调理。
  • 低压供电的滤波器、比较与电压跟随器设计。
  • 电池供电设备、便携式医疗与手持测试仪器。

四、使用与设计建议

  • 为保证低噪声与稳定性能,建议在电源引脚做良好去耦(如 0.1 µF 陶瓷并联 1 µF 电容)。
  • 器件内置补偿,适合单位增益配置;在闭环时注意带宽与相位裕度的匹配,避免在高增益与重负载下产生振荡。
  • 虽能驱动较高负载(典型 23 mA),但尽量避免长期驱动重阻性或大电容负载,以降低失真与发热。
  • 在高精度直流测量场合,利用低 Vos 与低温漂优势,同时注意输入保护以防静电或瞬态冲击。

五、封装与订购信息

  • 品牌:HGSEMI(华冠)
  • 器件型号:LMV324M/TR(四路,SOP-14,卷带包装)
  • 封装:SOP-14,适合批量贴片生产与自动化装配。

LMV324M/TR 以低功耗、轨到轨输入输出与良好直流性能为特点,是便携与低压系统中常见的通用运放选择。在实际设计中,按上述建议做好电源与负载管理,可发挥其在音频、传感与低功耗测量等领域的优势。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.