WMSIC Electronic Components

HGSEMI HG5532M/TR HG5532M

ModelHG5532M/TR
PackageSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI HG5532M / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
HG5532M/TR
Electronic Component
1
Package
SOP-8
Electronic Component
Operational Amplifier
Electronic Component
0.24g
Electronic Component
1
Features
Built-in
Electronic Component
BM0233531963
Operating Temperature
0℃~+70℃
Amplifier
2
(SR)
11V/us
Electronic Component
Electronic Component
Electronic Component
2500
(GBW)
10MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HG5532M/TR 运算放大器产品概述

一、产品简介

HG5532M/TR 是华冠(HGSEMI)推出的一款双路运算放大器,封装为 SOP-8,适用于中低频、高保真度的信号放大和处理场合。该器件在宽电源电压范围内工作,具备较低噪声、较高压摆率和良好的共模抑制能力,适合音频前级、滤波器、仪表放大与信号调理等应用。

主要基础参数(典型/最大值):

  • 放大器数:双路
  • 最大电源宽度 (Vdd–Vss):44 V(建议双电源 ±22 V 最大)
  • 增益带宽积 (GBP):10 MHz
  • 输入失调电压 (Vos):5 mV
  • 压摆率 (SR):11 V/µs
  • 输入偏置电流 (Ib):500 nA
  • 输入失调电流 (Ios):5 nA
  • 噪声密度 (eN):8 nV/√Hz @ 1 kHz
  • 共模抑制比 (CMRR):100 dB
  • 工作温度范围:0 ℃ ~ +70 ℃
  • 封装:SOP-8
  • 标识:HG5532M/TR(TR 常表示卷带包装)

二、性能亮点

  • 低噪声特性:1 kHz 处噪声密度仅 8 nV/√Hz,对于音频、前置放大器和精密放大场合能有效降低底噪。
  • 良好带宽与稳定性:10 MHz 的增益带宽积,使得在中等增益下仍能保持较高的速率和带宽,适用于宽带模拟信号处理。
  • 较高压摆率:11 V/µs 能够较好地应对瞬态信号,减少大幅度快速变化时的失真与钳位。
  • 优秀的共模抑制:100 dB 的 CMRR 提高了共模干扰抑制能力,有利于差分微小信号的精确处理。
  • 低输入失调与偏置:5 mV 的输入失调电压与 500 nA 的偏置电流,使直流精度良好,适合低频精密检测与放大。

三、典型应用场景

  • 音频放大与前置放大器:低噪声与良好线性使其适用于麦克风前置、耳机驱动前级、音频滤波器等。
  • 主动滤波器与等化器:增益带宽与压摆率满足多阶主动滤波器设计要求。
  • 仪表放大与信号调理:高 CMRR 与低输入失调适合测量电路、传感器信号放大。
  • 数据采集前端:用于放大、缓冲低电平传感器信号以驱动 ADC。
  • 通用运放用途:反相、同相放大,缓冲器、差分放大器等常见电路均可实现。

四、使用建议与注意事项

  • 电源与去耦:器件支持最大 44 V 的电源差(±22 V),建议在实际设计中使用标准余量(例如 ±12 V、±15 V 等)并在电源引脚近端并联 0.1 µF 陶瓷电容与 10 µF 大容量电解电容进行去耦,以抑制瞬态和高频噪声。
  • 布局原则:对于要求低噪声和低偏置电流的设计,输入端应尽量缩短走线并使用守护地(guard)或屏蔽技术以减少漏电流和串扰;反馈元件应靠近引脚布局,避免形成环路面积。
  • 偏置与失调校正:若系统对直流精度要求很高,可通过外接平衡电路或在反馈回路中加入微调电位器来校准输入失调。注意输入偏置电流可能在极高阻抗源下引起误差,应适当匹配偏置电阻以减小失配造成的偏移。
  • 工作温度:器件为商业温度等级(0 ℃ ~ +70 ℃),若用于更苛刻环境需采用温度范围更宽的器件或加温控保护。
  • 输入保护:在可能出现过压或反向输入电压的场合,应采用限流电阻、二极管或 TVS 保护器件保护输入端,防止损坏。

五、封装与订购信息

  • 封装形式:SOP-8,适用于中小批量手工或自动化贴装生产。
  • 包装:型号后缀 TR 通常表示卷带(Tape & Reel)包装,便于 SMD 自动化贴装。
  • 建议采购:依据实际生产需求选择散装或卷带包装;如有特殊可靠性、温度等级或测试要求,可联系供应商确认额外版本与测试数据。

六、总结

HG5532M/TR 是一款面向多用途模拟信号处理的双路运算放大器,结合低噪声、较高压摆率与良好共模抑制的特点,适用于音频、滤波、仪表与数据采集等中低频应用。合理的电源去耦、PCB 布局和输入保护能发挥该器件的最佳性能。欲获得更详细的电气特性曲线、封装尺寸与典型应用电路,请联系华冠(HGSEMI)或参考官方完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.