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HGSEMI LM1875T
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HGSEMI LM1875T
- Type
- HGSEMI
- Minimum package
- 1000 盒
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HGSEMI
- Electronic Component
- LM1875T
- Electronic Component
- 1
- Package
- TO-220B-5
- Electronic Component
- Audio Power Amplifier
- Electronic Component
- 2.62g
- Electronic Component
- 1
- Electronic Component
- BM0227688675
- Operating Voltage
- 16V~60V
- Static Current(Iq)
- 70mA
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
- Power Supply (PSRR)
- 83dB；95dB
- + (THD+N)
- 0.015%
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LM1875T 音频功率放大器（HGSEMI 华冠，TO-220B-5）
一、产品概述
LM1875T 是一款用于音频功率放大的线性集成电路，HGSEMI（华冠）品牌封装为 TO-220B-5，针对家庭音响、台式音频放大器和小型有源扬声器等中等功率音频应用设计。器件在低失真和低噪声条件下提供稳定的驱动能力，适合对音质有较高要求的模拟前端放大与功率输出级。
二、主要电气性能
- 静态电流 (Iq)：70 mA（典型值）
- 总谐波失真 + 噪声 (THD+N)：0.015%（典型值，条件依赖）
- 电源纹波抑制比 (PSRR)：83 dB；95 dB（不同频率或测试条件下的典型值）
- 工作电压范围：16 V ~ 60 V
- 封装：TO-220B-5（便于安装散热器）
以上参数表明器件在中低频段具有优秀的线性表现和较强的电源抑制能力，适合对电源干扰敏感的音频系统。
三、应用场景
- 家用或专业级音响功率放大器（中等功率）
- 有源书架箱、低功率扬声器驱动单元
- 音频前级与功率级混合设计、DIY 音响项目
- 需要低失真、高信噪比的模拟音频电路
四、设计与布局建议
- 电源退耦：在器件电源引脚附近并联大容量电解电容（例如 100 µF）与陶瓷高频电容（0.1 µF），以保证在宽频带内的稳定电源抑制。
- 增益与反馈：按数据手册建议选择反馈网络，避免过高增益导致振荡，通常采用局部负反馈以兼顾带宽与稳定性。
- 输出负载与补偿：尽量避免直接驱动强容性负载，必要时在输出与扬声器之间加入小电阻或 Zobel 网络以维持稳定性。
- 散热管理：TO-220B-5 封装需配合合适散热片，注意垫片和绝缘件的使用，保持结温在安全范围内以提高长期可靠性。
- 布线与接地：模拟地与电源地应分区处理，地回路短、信号线远离开关电源和大电流回路，减少干扰注入。
五、注意事项与可靠性
- 工作电压需控制在推荐范围内，瞬态浪涌可能损伤器件，建议加上合适的浪涌抑制与保护电路。
- 器件静态电流较高（70 mA），在多通道设计中需考虑功耗与电源能力。
- 在高功率输出时，需充分考虑散热并避免长时间在高结温下工作，以防热失控或参数漂移。
- 依据实际应用场景进行测试（频响、失真、稳定性和热特性），并参照 HGSEMI 提供的数据手册进行最终电路确认。
结论：LM1875T（HGSEMI，TO-220B-5）以低失真、良好 PSRR 和适中的供电范围，适合中等功率、高音质要求的音频放大应用。合理的电源退耦、散热和 PCB 布局是发挥其性能的关键。若需详细典型电路或 PCB 布局示例，可提供应用场景以便给出更具体的设计建议。
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