WMSIC Electronic Components

HGSEMI LM336Z-2.5 LM336Z

ModelLM336Z-2.5
PackageTO-92
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM336Z-2.5
Type
HGSEMI
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LM336Z-2.5
Electronic Component
1
Package
TO-92
Electronic Component
Voltage Reference IC
Electronic Component
±1%
Electronic Component
0.22g
Electronic Component
1
Electronic Component
BM0229355073
Operating Temperature
0℃~+70℃
Operating Voltage
4V~6V
Output Voltage
5V
Output Current
10mA
Output Type
Electronic Component
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM336Z-2.5 产品概述

一、产品简介

LM336Z-2.5 是一款基于串联/并联基准思想的固定电压基准源,提供标称 2.5V 的低温漂、低噪声参考电压。该器件属固定输出型齐纳式(或称为“分流基准”),适用于需要稳定参考电压的小功率模拟电路与便携设备。华冠(HGSEMI)出品的 TO-92 封装版本便于穿孔安装与快速样机验证。

二、主要电气参数

  • 输出类型:固定(2.5V 标称输出)
  • 工作电压(供电范围建议):4V ~ 6V(配合串联限流电阻以保证适当的阴极电流)
  • 输出电压:2.5V(LM336Z-2.5)
  • 最大阴极电流(可吸收电流):典型 10mA(设计时应避免长期满量程)
  • 最小阴极电流以维持调节:约 400µA
  • 精度:±1%(初始容差)
  • 工作温度范围:0℃ ~ +70℃(商用级)
  • 封装:TO-92(便于手工焊接与面包板调试)
    (注:上述参数以华冠 LM336Z-2.5 标准规格为准,具体设计请参考芯片规格书)

三、性能特点

  • 高精度:±1% 初始精度,适合多数精密测量与参考电路应用。
  • 低电流可调节:最低约 400µA 即能进入规范化调节状态,适合低功耗系统。
  • 容易驱动:作为分流基准,通过串联电阻即可在常见电源电压下获得稳定基准。
  • 稳定性与温漂:商用级温度范围内具有良好温度稳定性,适合常温环境下的工业与消费类应用。
  • 封装友好:TO-92 封装成本低,易于替换与手工接入测试平台。

四、典型应用场景

  • ADC/DAC 的基准电压源,提供稳定参考以提高测量精度。
  • 精密电压比较电路、过压/欠压检测电路。
  • 低功耗便携设备的内部参考。
  • 仪表放大器和传感器接口的参考节点。
  • PCB 原型验证与教学实验,TO-92 便于面包板使用。

五、使用建议与注意事项

  • 供电及限流:LM336 为并联(分流)基准,需要在阳极与电源之间串联限流电阻,以保证阴极电流在 400µA ~ 10mA 范围内。根据供电电压与负载选择合适电阻并考虑器件功耗。
  • 去耦电容:为减小噪声与改善瞬态响应,建议在基准输出到地加一个小的陶瓷电容(常见值 0.1µF ~ 1µF)。
  • 热管理:虽然功耗不高,但在接近 10mA 的工作点时需注意器件自身发热及长期可靠性。
  • 温度与漂移:若有更严苛的温度系数要求,应参考数据手册中的温漂曲线,或选择温度系数更优的型号。
  • 封装与布局:TO-92 适合低成本与小批量应用,量产时可考虑 SOT-23 等表贴封装以利于 SMT 工艺。

六、封装与品牌信息

  • 品牌:HGSEMI(华冠)
  • 封装:TO-92,三引脚直插形式,方便实验与小批量生产试装。

总结:LM336Z-2.5(HGSEMI,TO-92)以其 ±1% 的初始精度、低电流可调性和简单的外部电路要求,适合多数对成本与空间有要求的参考电压场合。设计时注意限流、去耦与热耗分配,即可获得稳定可靠的 2.5V 基准电压。若需更详细的参数(温漂、噪声、典型曲线及等效电路),建议参阅器件完整规格书。

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