WMSIC Electronic Components

HGSEMI LM1086T-3.3 LM1086T

ModelLM1086T-3.3
PackageTO-220
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM1086T-3.3
Type
HGSEMI
Minimum package
1000 盒

Technical parameters

Electronic Component
Electronic Component
Electronic Component
1.3V@(1.5A)
Electronic Component
HGSEMI
Electronic Component
0.003%Vout
Electronic Component
LM1086T-3.3
Electronic Component
1
Package
TO-220
Electronic Component
Linear Regulator(LDO)
Electronic Component
2.74g
Electronic Component
1
Electronic Component
BM0227699423
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
15V
Output
Electronic Component
Output Voltage
3.3V
Output Current
1.5A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM1086T-3.3 产品概述

一、概述

LM1086T-3.3 是一款固定输出、正极性线性低压差稳压器(LDO),提供稳定的 3.3V 输出,最大输出电流可达 1.5A。该器件集成过热保护与过流保护,适用于对噪声和纹波有较高要求的电源前端和模块供电场景。器件采用 TO-220 封装,便于加装散热片以满足高功率工况下的热量管理需求。

二、主要性能参数

  • 输出电压:3.3V(固定)
  • 最大输出电流:1.5A
  • 压差(Dropout):1.3V @ 1.5A
  • 静态电流(Iq):5mA(典型)
  • 工作温度:-40℃ ~ +125℃(Tj)
  • 最大输入电压:可支持至 30V(产品说明);常见系统工作电压示例:15V
  • PSRR(电源纹波抑制比):75dB @ 120Hz,显著降低电源纹波对输出的影响
  • 输出噪声:0.003% Vout(约 99µV, 3.3V 输出时)
  • 保护功能:内部过热保护与过流限流
  • 封装:TO-220,品牌:HGSEMI(华冠)

三、热管理与功耗计算

线性稳压器的功耗由 (Vin − Vout) × Iout 决定。举例:当 Vin = 12V、Vout = 3.3V、Iout = 1.5A 时,器件耗散功率约 13.05W,需可靠散热措施(散热片或系统散热槽)。在设计时应依据最大输入电压、最大负载电流与允许结温来计算所需散热阻并做热裕度。

四、典型应用场景

  • 工业控制与嵌入式系统的 3.3V 供电
  • 噪声敏感的模拟前端与数模混合电路
  • 单板电源分配、接口逻辑供电(USB 外设、MCU、FPGA 低速外围)
  • 需要简单、可靠保护功能的电源模块

五、外围设计与注意事项

  • 输出端应配合低 ESR 的输出电容以保证稳压器稳定性和瞬态响应(建议参考厂商验证图或常用低 ESR 钽/固态电容)
  • 输入端增加合适的去耦电容以降低高频纹波和瞬态电压尖峰
  • 高电流工况下优先采用良好接地和短路线布局,TO-220 引脚间距与散热片安装要确保热阻最小化
  • 在接近最大电流或高 Vin 场合,建议在布局时预留热熔丝和热检测位置以提高系统可靠性

若需基于具体应用的输入电压范围、输出电容型号选择或散热片规格计算,我可根据您提供的工作条件给出更详细的设计建议。

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