WMSIC Electronic Components

HGSEMI LM2595S-5.0/TR LM2595S

ModelLM2595S-5.0/TR
PackageTO-263-5
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM2595S-5.0 / TR
Type
HGSEMI
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
LM2595S-5.0/TR
Electronic Component
1
Package
TO-263-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
2.292g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227677191
Operating Temperature
40℃~+125℃
Operating Voltage
4.5V~40V
Switching Frequency
150kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM2595S-5.0/TR 产品概述

一、产品简介

LM2595S-5.0/TR 是华冠(HGSEMI)提供的一款内置开关管的降压型 DC-DC 转换器,固定输出 5.0V,最大输出电流 3A。其工作电压范围宽(4.5V ~ 40V),开关频率约 150kHz,工作温度范围 -40℃ ~ +125℃,封装为 TO-263-5。该器件为非同步整流结构(需外接肖特基二极管),静态工作电流约 3.6mA,适用于车载、电源模块和工业电源等需要从高压降至固定 5V 的场合。

二、主要特性

  • 功能类型:降压(Buck)型固定输出 5.0V
  • 输入电压:4.5V ~ 40V,适应 12V/24V 等常见总线电压
  • 输出能力:最大 3A(视散热与外围器件而定)
  • 开关频率:约 150kHz,有利于在合适的电感与电容下兼顾效率与体积
  • 同步整流:否(需外接低压降肖特基二极管)
  • 静态电流:约 3.6mA,轻负载下功耗低
  • 封装:TO-263-5,便于散热与高电流接入
  • 工作温度:-40℃ ~ +125℃,满足恶劣环境要求

三、典型应用场景

  • 汽车电子:12V/24V 转 5V 电源供应(需注意瞬态浪涌及抑制)
  • 工业控制与自动化设备:模块化电源、传感器供电
  • 通信设备与网络终端:稳定 5V 电源输出
  • 嵌入式系统与单板电源:对成本和体积有要求的场合

四、外围器件与电路设计要点

  • 需外接功率电感、输入/输出电容与肖特基整流二极管。由于为非同步整流,选择低正向压降的肖特基二极管可显著提升高电流下的效率。
  • 输出滤波与环路稳定性依赖电感与输出电容的 ESR,设计时按参考应用电路选择器件并验证瞬态响应。
  • 输入端应加足够的去耦电容以抑制开关尖峰,且放置靠近器件引脚。建议在布局时将敏感电流回路最短化、地线集中回流,减小 EMI。

五、热设计与封装注意

TO-263-5 封装具备较好散热能力,但 3A 工作点下功耗不可忽视。建议:

  • 在 PCB 上为封装底部和散热引脚预留大面积铜箔(多层板时连通散热层),并采用热过孔加强散热。
  • 评估在最坏工况(高输入电压、高环境温度、满载)下的结温,必要时增加散热片或外部散热措施。

六、可靠性与使用建议

  • 由于开关式降压器会产生开关噪声,关键模拟/通信模块应做好地分割与滤波。
  • 为保护电源与负载,建议在输入侧加熔断或保护元件,并对输出进行短路、过流评估与限制设计。
  • 在量产前务必按实际系统环境做热仿真与电磁兼容(EMC)测试。

七、选型考量与替代方案

当系统要求更高效率或省去外置肖特基时,可考虑同步整流型降压器;若需更高开关频率以减小外部元件体积,可选择更高频率的器件。LM2595S-5.0/TR 适合对可靠性、宽输入电压与中高电流有明确要求且可接受外置整流二极管的应用场景。

总结:LM2595S-5.0/TR 提供了宽输入、电流能力强且封装易散热的固定 5V 降压解决方案,适合车载与工业级电源设计,但在高效率或体积极限场合应综合评估是否采用同步整流或更高频器件。

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