Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HGSEMI LM7815CT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HGSEMI LM7815CT
- Type
- HGSEMI
- Minimum package
- 50 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HGSEMI
- Electronic Component
- 90uV
- Electronic Component
- LM7815CT
- Electronic Component
- 1
- Package
- TO-220-3
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 2.745g
- Electronic Component
- 1
- Electronic Component
- BM0264801320
- Operating Temperature
- 0℃~+125℃@(Ta)
- Operating Voltage
- 35V
- Output
- Electronic Component
- Output Voltage
- 15V
- Output Current
- 1.5A
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LM7815CT（HGSEMI 华冠）产品概述
一、产品简介
LM7815CT 为 LM78xxC 系列 1.5A 稳压器的 15V 固定输出型号，由 HGSEMI（华冠）供货，常用 TO-220-3（也有 TO-263 封装）三引脚塑料封装，适用于电视、收录机、各类电子仪器与设备的线性稳压电源模块。输出为正极（正向稳压），结构简单、使用方便，适合中低频开关噪声抑制要求不高且热设计允许的场合。
二、主要电气参数
- 输出电压：15V（固定）
- 输出电流：最大 1.5A（连续使用需注意散热）
- 工作电压（绝对或最大输入）：35V
- 电源纹波抑制比（PSRR）：54dB @ 120Hz
- 噪声：90µV（典型）
- 工作温度（环境温度 Ta）：0℃ ~ +125℃
- 输出通道：单路
- 输出极性：正极
三、保护与可靠性
内置短路保护与热关断功能：在输出短路或过载时器件会限制电流并在过热时进入热关断以保护器件与负载。这些保护提高了使用安全性，但不意味着可长期在短路或高功耗状态下工作——长时间高功率损耗仍会导致器件周期性热关断或损坏。
四、热设计与散热提示
线性稳压器的功耗由 (Vin − Vout) × Iout 决定。举例：
- 若 Vin = 18V、Iout = 1.5A，则 Pd = (18 − 15) × 1.5 = 4.5W（可用小型散热片）
- 若 Vin = 35V、Iout = 1.5A，则 Pd = (35 − 15) × 1.5 = 30W（需大散热器或改用开关方案）
建议按最大工作电流和最差环境温度计算散热片尺寸与热阻，确保结温不超限。TO-220 通过机壳与散热片接触效果最好，TO-263 则需要靠 PCB 大铜面积散热。
五、使用建议与典型外围元件
- 为保证稳定与瞬态响应，输入端常配 0.33µF 陶瓷/薄膜去耦，输出端配 0.1µF 陶瓷与 10–47µF 电解电容作滤波与负载突变缓冲，电容应靠近引脚布局。
- 保证输入电压比输出高出足够的差值（典型压差约 2V），建议 Vin ≥ Vout + 2V，以避免进入跌落输出模式。
- 布局时尽量缩短输入/输出旁路电容的回路，采用良好接地以发挥 PSRR 性能。
- 在高功耗场合考虑加入限流或预降压环节（如串联功率晶体或小型开关降压模块）以减轻散热负担。
六、典型应用场景与选型建议
适用于音视频设备、仪器仪表、实验台电源及其它对低噪声、稳定 15V 输出要求且功耗可控的场合。若系统需高效率或输入输出差压大且输出电流高，建议采用开关降压模块或并用前级降压以减少线性稳压器的功耗与散热压力。
如需详细引脚定义、热阻数据和典型特性曲线，请参阅 HGSEMI LM7815CT 规格书以获得精确设计参数。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
