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HGSEMI AMS1117-3.3/TR AMS1117
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HGSEMI AMS1117-3.3 / TR
- Type
- HGSEMI
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- 1.2V@(800mA)
- Electronic Component
- HGSEMI
- Electronic Component
- 0.003%Vout
- Electronic Component
- AMS1117-3.3/TR
- Electronic Component
- 1
- Package
- SOT-223
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.231g
- Electronic Component
- 1
- Electronic Component
- BM0264336490
- Operating Temperature
- 40℃~+125℃@(Tj)
- Operating Voltage
- 12V
- Output
- Electronic Component
- Output Voltage
- 3.3V
- Output Current
- 800mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
AMS1117-3.3/TR 产品概述
一、产品简介
AMS1117-3.3/TR（华冠 HGSEMI 版）是一款输出固定为 3.3V、最大输出电流 800mA 的线性低压差稳压器（LDO），采用 SOT-223 封装，适用于对成本、空间及散热有中等要求的 3.3V 电源方案。器件集成过流保护和热关断功能，可靠性高，适合工业级工作温度范围。
二、主要电气参数
- 输出电压：3.3V（固定型）
- 输出电流：最大 800mA
- 压降（Dropout）：约 1.2V @ 800mA（随负载而变化）
- 工作电压：典型用于 5V 输入向 3.3V 输出转换，输入电压应≥Vout+Vdrop
- 静态电流（Iq）：约 5mA
- PSRR：≈75dB @ 120Hz（低频纹波抑制良好）
- 噪声：约 0.003% × Vout（换算约 100µV 量级）
- 工作温度：-40℃～+125℃（结温）
三、保护与可靠性
芯片内部集成过流限制与热关断机制：在短路或过载情况下自动限制输出电流并在温度过高时关闭输出以保护器件；恢复后自动重启。适合带瞬态负载和不确定负载的应用，但长期靠近最大额定电流工作需注意热设计。
四、封装与热管理
SOT-223 封装便于通过 PCB 铜箔扩展散热区增强功率耗散。实际应用中，当输出电流接近 800mA 时，输入与输出之间的功耗（(Vin−3.3V)×Iout）会显著升高，建议使用足够的铜面积（多层板地平面或热沉）并优化器件布局以降低结温，保证长期可靠性。
五、外围元件与布局建议
为保证稳压器稳定工作并抑制高频噪声，推荐：
- 输出端并联 10µF（钽或固态电解）与 0.1µF 陶瓷去耦，确保 ESR 在器件手册允许范围内；
- 输入端靠近 VIN 脚放置 10µF 电容及 0.1µF 陶瓷，减少输入线感抗；
- Vout、GND 的走线尽量短粗，GND 端优先回到稳压器的地引脚，避免地环路；
- 在高功耗或高环境温度场合，考虑增加散热铜箔或改用更大封装/外部散热片。
六、典型应用场景
适用于单电池或 5V 电源降压到 3.3V 的 MCU、传感器、射频模块、通信模块、液晶驱动电源等低压系统。特别适合空间受限且对成本敏感的批量产品。
七、封装与订购信息
器件型号为 AMS1117-3.3/TR，SOT-223 封装，/TR 常表示卷带（Tape & Reel）包装，便于自动贴片生产。选型时请关注制造商/供应商的实际数据手册与批次差异，并对照热阻与最大功耗进行确认。
小结：AMS1117-3.3/TR 提供稳健的 3.3V 输出与必要的保护功能，适合中低端应用，但在高电流、高压差场合需认真做热设计与输出电容匹配以保证稳定性与寿命。
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