WMSIC Electronic Components

HGSEMI LM317S/TR LM317S

ModelLM317S/TR
PackageTO-263-3
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM317S / TR
Type
HGSEMI
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
40V@(1.5A)
Electronic Component
HGSEMI
Electronic Component
LM317S/TR
Electronic Component
1
Package
TO-263-3
Electronic Component
Linear Regulator(LDO)
Electronic Component
2.288g
Electronic Component
1
Electronic Component
BM0264801310
Operating Temperature
0℃~+70℃@(Ta)
Operating Voltage
40V
Output
Electronic Component
Output Voltage
1.2V~37V
Output Current
1.5A
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM317S/TR 产品概述

一、产品简介

LM317S/TR 是 HGSEMI(华冠)推出的一款可调式三端正电压稳压器,输出极性为正极。器件在输出电压约 1.2V(典型参考电压 1.25V)至 37V 范围内可调,最大输出电流可达 1.5A。内部集成限流、热关断与安全工作区补偿,能在多数异常工况下保护器件和外部电路不致损坏,使用简单且可靠性高。常见封装为 TO-263-3(D2PAK),适合表面贴装应用。

二、主要性能参数

  • 输出电压:可调 1.2V ~ 37V(典型参考电压约 1.25V)
  • 最大输出电流:1.5A
  • 最大输入-输出电压差:40V(在 1.5A 条件下)
  • 电源纹波抑制比(PSRR):65dB @ 120Hz(典型条件)
  • 功能保护:热关断、过流限制、短路保护(安全工作区补偿)
  • 工作环境温度:Ta 0℃ ~ +70℃(环境温度范围)
  • 输出类型:可调输出;单通道

三、外部电路与使用建议

  • 输出电压设定公式:VOUT ≈ VREF × (1 + R2/R1) + IADJ×R2(其中 VREF 约 1.25V,IADJ 很小通常可忽略)。为获得稳定表现常用 R1 = 240Ω,R2 按目标电压计算。
  • 建议输入/输出去耦:输入侧使用 0.1µF 陶瓷并联 10µF47µF 电解电容;输出侧配备 1µF25µF 电解或钽电容以保证稳定性。
  • 提高 PSRR:在 ADJ 引脚与地之间并联一个 10µF 左右的电容(旁路电容)可显著提升纹波抑制与输出噪声性能。
  • 恒流应用:将稳压器工作于恒流模式时,可利用 VREF 与外部电阻实现 IOUT ≈ VREF / RSET 的限流源设计。

四、散热与保护考虑

LM317 在工作时的功耗主要来自 Vin-Vout 与输出电流的乘积(Pd = (Vin - Vout) × Iout)。当电压差或输出电流较大时需加强散热:建议配合 PCB 大面积铜箔、热过孔或外接散热片使用。内部热关断可防止过热损坏,但长期稳定工作需保证结温在安全范围内。器件集成的限流与短路保护能在短时间冲击下保护电源与负载,但并非替代适当的热设计与熔断器。

五、典型应用场景与封装信息

  • 典型应用:可调稳压电源、线性后级稳压、实验室电源、低噪声模拟电源、通信设备、传感器供电、简单电池充电与限流电路等。
  • 封装与订购:常用封装为 TO-263-3(SMD / D2PAK),适配工业与消费类电子的表面贴装工艺。订购时请参考 HGSEMI 型号 LM317S/TR 并核对封装与热特性需求。

总结:LM317S/TR 以其调节范围宽、保护功能齐全、使用简便而广泛应用于需要线性可调电压与低噪声特性的场合。在设计时注意输入输出去耦、ADJ 旁路与热管理,能获得稳定可靠的性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.