WMSIC Electronic Components

HGSEMI LM7812S2/TR LM7812S2

ModelLM7812S2/TR
PackageTO-263-2
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI LM7812S2 / TR
Type
HGSEMI
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
75uV
Electronic Component
LM7812S2/TR
Electronic Component
1
Package
TO-263-2
Electronic Component
Linear Regulator(LDO)
Electronic Component
2.406g
Electronic Component
1
Electronic Component
BM0264336481
Operating Temperature
0℃~+125℃@(Ta)
Operating Voltage
35V
Output
Electronic Component
Output Voltage
12V
Output Current
1.2A
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM7812S2/TR 产品概述

一、产品简介

LM7812S2/TR 是华冠(HGSEMI)推出的一款正电压线性稳压器,属于经典 LM78xx 系列的固定输出型号。该器件在 TO-263-2(D2PAK)封装中提供,适用于需要稳定 12V 直流电源的各类电子设备,如电视、收音机、电子仪器以及工业控制设备。器件为线性稳压结构,输出为单路固定 12V,便于系统设计与电源管理。

二、主要参数

  • 输出极性:正极输出
  • 工作电压(输入):最高可在 35V 条件下工作
  • 输出电压:12V(固定)
  • 最大输出电流:1.2A(连续)
  • 电源纹波抑制比(PSRR):55 dB @ 120 Hz
  • 输出噪声:75 µV(典型)
  • 工作温度范围:0 ℃ ~ +125 ℃(Ta)
  • 输出通道数:1(单路)
  • 功能特性:短路保护、热关断

以上参数使 LM7812S2/TR 在中等功率、对噪声与纹波有一定抑制需求的应用中表现可靠。

三、保护与热管理

LM7812S2/TR 内置短路电流限制和热关断保护,能在输出短路或过载时限制电流并在过温时关断输出,避免器件损坏。但作为线性稳压器,其功率耗散与输入输出压差及负载电流成正比:Pd = (Vin − Vout) × Iout。在较大 Vin−Vout 或高负载电流条件下需评估并采取散热措施(如 PCB 散热铜箔、散热片或合适的贴片散热处理),以保证长期可靠性和不触发热关断。

四、封装与引脚

产品采用 TO-263-2(D2PAK)表面贴装封装,适用于自动贴装与回流焊工艺。该封装便于在有限空间内提供较好的导热通道,底部与散热焊盘的良好连通有利于热量散发。设计 PCB 时建议在焊盘下方和周围安排充足的散热铜面积并与底层过孔通热。

五、典型应用与设计注意事项

  • 典型用途:消费电子电源、工业控制模块、接口电源、仪器仪表供电等。
  • 输入/输出旁路电容:为保证稳定性与瞬态响应,建议输入端并联 0.1–1 µF 陶瓷电容以抑制高频干扰;输出端建议配置 1–10 µF 低 ESR 的电解/钽电容,并在并联少量陶瓷电容以优化噪声与瞬态性能。根据系统布局与负载特性调整容值与 ESR。
  • 布局要点:输入电容尽量靠近器件 VIN 引脚布置,输出电容靠近 VOUT 引脚;保证接地回路短且回流路径合理。
  • 热设计:计算最大功耗并预留安全裕度,必要时使用外部散热器或增加 PCB 散热面积。
  • 可靠性与制造:遵循焊接工艺规范,避免超温或长时间回流停留。

六、订购与使用建议

订购型号:LM7812S2/TR,品牌:HGSEMI(华冠),封装:TO-263-2。使用前请参考华冠提供的完整数据手册,确认电气特性、典型曲线及封装机械尺寸。工程应用阶段建议进行热仿真与实际功耗测试,验证在最坏工况下的可靠性与稳定性。

如需进一步的电路参考或 PCB 布局建议,可提供具体工作电压、输入源特性与负载条件,以便给出更针对性的设计方案。

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