WMSIC Electronic Components

HGSEMI 74HC273M/TR 74HC273M

Model74HC273M/TR
PackageSOP-20
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI 74HC273M / TR
Type
HGSEMI
Minimum package
2000 圆盘

Technical parameters

Electronic Component
positions
Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
74HC273M/TR
Electronic Component
1
Package
SOP-20
Type
D
Electronic Component
Flip-Flop
Electronic Component
74HC
Electronic Component
0.78g
Electronic Component
1
Electronic Component
Electronic Component
Electronic Component
1
Latching
3ns
Electronic Component
BM0265006070
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

74HC273M/TR 产品概述

一、产品简介

74HC273M/TR(HGSEMI / 华冠)是一款高性能的8位D型触发器寄存器,采用74HC高速硅栅CMOS工艺,封装形式为SOP-20。器件内部包含八个上升沿触发的D触发器,具有独立的异步主复位(MR,低有效)输入。器件在时钟上升沿对D输入进行采样并在Q输出反映对应的状态,适用于并行数据暂存、总线隔离、移位缓冲以及微处理器接口等多种数字电路场景。

二、主要特性

  • 类型:D 型触发器,单元数:1,位数:8(8-bit)
  • 触发沿:上升沿触发(rising-edge)
  • 工作电源电压:2.0 V ~ 6.0 V,适应宽电压系统设计
  • 最大工作时钟频率(典型):103 MHz(标称条件)
  • 异步复位:MR 为低电平时非同步将所有Q输出清零(与时钟、数据无关)
  • 输入保护:输入端带钳位二极管,可在加装限流电阻后承受短时超过VCC的电压
  • 低功耗 CMOS:静态电流 Iq 典型值 8 µA(静态工作时)
  • 封装:SOP-20,便于高速、密集布局的表面贴装应用

三、电气与时序参数(典型/关键值)

  • 传播延迟 tpd:15 ns(VCC = 4.5 V,CL = 15 pF,典型)
  • 建立时间(t_setup):12 ns(要求在时钟上升沿前数据稳定)
  • 保持时间(t_hold):3 ns(要求在时钟上升沿后数据保持)
  • 输出灌电流 IOL:4 mA(典型额定能力,指输出低电平下的驱动能力)
  • 输入电容 Cin:约 3.5 pF
  • 工作温度范围:-40 ℃ ~ +85 ℃

以上参数为典型条件下参考值,实际系统设计应参考完整器件手册中的极限值和推荐工作条件,并结合PCB走线、电容负载及工作温度进行裕量设计。

四、功能说明与行为

  • 时序行为:在时钟(CP)信号的上升沿,八路D输入(D0–D7)被并行捕捉并传至对应的Q输出(Q0–Q7)。只要满足建立/保持时间要求,Q将稳定反映采样时的D状态。
  • 异步复位(MR):MR 为低电平时立即将所有Q输出置低,不必等待时钟边沿;MR 回高后器件恢复正常触发功能(复位期间对D和CP无响应)。
  • 输入保护:器件输入集成钳位二极管,允许在必要时通过外部限流电阻连接高于VCC或低于GND的信号,但必须限制注入电流至安全范围,避免损伤器件或破坏逻辑状态。
  • 可靠性与兼容性:遵循标准74HC逻辑电平接口,便于与其他TTL/CMOS逻辑器件互联(在不同电源电压下注意电平兼容性)。

五、应用场景与使用建议

  • 典型应用:并行数据暂存寄存器、总线驱动/隔离、数据捕获与同步、微处理器接口、数据缓冲和暂存、寄存器堆扩展。
  • 使用建议:
    • 时序裕量:设计时应留有建立/保持时间裕量,并在PCB布局中尽量降低时钟抖动与信号串扰。
    • 负载考虑:传播延迟与最大工作频率与负载电容(CL)密切相关,建议尽量减小输出负载电容并避免长线驱动多个大电容输入。
    • 输入保护使用:若输入可能出现高于VCC或低于GND的瞬态,应在输入端串联合适阻值的限流电阻,并核算钳位电流对器件和系统的影响。
    • 电源旁路:在高频应用下,器件电源引脚应在靠近封装处放置去耦电容(例如0.1 µF陶瓷)以抑制电源瞬态并保持稳定工作。
    • 温度与电源:在极端温度或低电压(接近 2.0 V)条件下,关注器件性能退化并验证系统工作裕度。

六、封装与订购信息

  • 品牌:HGSEMI(华冠)
  • 型号:74HC273M/TR
  • 封装:SOP-20(表面贴装)
  • 建议在采购与设计中参考HGSEMI提供的完整版数据手册(Datasheet)以获取极限参数、详细时序波形、典型应用电路及推荐PCB布局和焊接说明。

总结:74HC273M/TR 是一款可靠、低功耗且时序性能良好的8位上升沿触发D触发器寄存器,适合高速数字系统中的数据暂存与总线控制应用。在具体设计中应依据时序、负载和电源条件选取合适的工作点,保证系统的稳定与可靠。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.